Mentor, A Siemens Business

8005 SW Boeckman Rd
Wilsonville,  OR  97070-9733

United States
http://www.mentor.com
  • Booth: 2335

Welcome to Mentor, A Siemens Business located at Booth 2335

Xpedition HDAP Package design, a comprehensive end-to-end solution, from rapid prototyping to GDS signoff, combines the Mentor® Xpedition, HyperLynx®, and Calibre® technologies. The new Mentor IC package design flow delivers faster, higher-quality results compared to existing methodologies and technologies. Mentor will be showcasing Advanced IC Package prototyping and comprehensive verification of 2.5/3D heterogeneous and homogeneous multi-die devices.

www.mentor.com/pcb/ic-packaging

Mentor’s Tanner EDA is the price performance leader for the design, layout and verification of analog/mixed-signal (AMS) ICs, as well as MEMS and IoT devices. In Mentor’s booth (2335), Tanner will be demonstrating analog/mixed signal IC design from schematic capture, simulation, custom layout, P&R and verification; MEMS design from layout to 3D modeling; and Photonic Design automation.

www.mentor.com/tannereda


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
Yes
Please indicate which industries/technologies your company serves
MEMS

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".


For Technical Support with this webpage, please contact support.