July 12-14, 2016
San Fransisco, CA
Welcome to Mentor, A Siemens Business located at Booth 2335
Xpedition HDAP Package design, a comprehensive end-to-end solution, from rapid prototyping to GDS signoff, combines the Mentor® Xpedition, HyperLynx®, and Calibre® technologies. The new Mentor IC package design flow delivers faster, higher-quality results compared to existing methodologies and technologies. Mentor will be showcasing Advanced IC Package prototyping and comprehensive verification of 2.5/3D heterogeneous and homogeneous multi-die devices.
Mentor’s Tanner EDA is the price performance leader for the design, layout and verification of analog/mixed-signal (AMS) ICs, as well as MEMS and IoT devices. In Mentor’s booth (2335), Tanner will be demonstrating analog/mixed signal IC design from schematic capture, simulation, custom layout, P&R and verification; MEMS design from layout to 3D modeling; and Photonic Design automation.