Osiris International GmbH

Gewerbestr. 13
Moos,  78345

Germany
http://www.osiris-nano.com
  • Booth: 2144


We invite you to visit us on our booth 2144

Osiris International is a manufacturer of machines specializing in photolithographic process equipment used in semiconductor and microsystems (MEMS) technology.

The main application areas for surface treatment of wafers, substrates or masks are the following processing applications.

photoresist spin & spray coating, developing, baking,
wet cleaning, post CMP cleaning, etching, stripping & lift-off and
temporary bonding & de-bonding.

In addition to the production of our machines, which range from laboratory systems to semi-automatic and fully automatic systems, we also offer sub-systems such as PR Dispense Systems (Pumps, Syringe or CPD) and media supply cabinets with various canister designs.

We supply our technologies worldwide to major semiconductor manufacturers and internationally renowned research and development institutions.

In addition to our office in Germany, which covers all areas of administration, production and development, there is a foreign branch office Osiris International Inc. in Phoenix, Arizona especially for our US customers.


 Products

  • AFIXX 20M - TEMPORAY BONDING SYSTEM
    Table-top system for manual temporary bonding of individual substrates onto rigid carriers or other substrates....

  • TEMPORAY BONDING SYSTEM
    AFIXX 20M
    Table-top system for manual temporary bonding of individual substrates onto rigid carriers or other substrates. It is suitable for very thin fragile substrates and flexible plastic materials.

    PROPERTIES (MAUNAL SYSTEM)
    ÷ For round wafer or square substrates
    ÷ Substrates sizes from pieces up to Ø 200 mm (Ø 8‟) or 150 x 150 mm (6 x 6 inch)

       optional for round wafers: Ø 300 mm (Ø 12″)
    ÷ With hotplate up to 200ºC
    ÷ Suitable for very thin fragile wafers (< 40 μm) and flexible plastic materials
    ÷ Laser Marks for accurate alignment of wafer and carrier
    ÷ Temp. bonding head support for safe operation
    ÷ Excellent TTV
    ÷ Compatible with silicon, compound and glass materials
    ÷ Designed for R&D and low volume production

  • DEFIXX 30M - WAFER DEBONDING SYSTEM
    Manual, table-top system was designed for debonding individual wafers from rigid carriers or other wafers....

  • WAFER DEBONDING SYSTEM
    DEFIXX 30M

    Manual, table-top system was designed for debonding individual wafers from rigid carriers or other wafers. DEFIXX 30m equipped with the patented wafer debonding head is an ideal solution for your toughest wafer demounting requirements.

    PROPERTIES (MANUAL SYSTEM)
    ÷ Wafer size from pieces up to ø300mm (ø12")
    ÷
     Safe thin wafer handling < 40μm
    ÷ Debonding with adjustable force
    ÷ Holding plate for carriers with vacuum holes
    ÷ Adjustable vacuum line to protect fragile/sensitive wafers
    ÷ Imbedded heaters on wafer and carrier plates
    ÷ Two temperature controller
    ÷ Temperature range adjustable up to 200°C
    ÷ Temperature uniformity of +/- 0,5°C
    ÷ Easy to operate
    ÷ Low cost of ownership
    ÷ Flexible configurations

  • OOPXX - DISPENSE PUMP SYSTEM
    The patented Osiris Oyster Pump is designed for highest dispense repeatability during the process and does not require sensor systems....

  • DISPENSE PUMP SYSTEM
    OOPXX

    The patented Osiris Oyster Pump is designed for highest dispense repeatability during the process and does not require sensor systems. Using only a weight scale and all activity around are programmable.

    PROPERTIES
    ÷ For low & high material viscosity
    ÷ Accurate digital displays
    ÷ Exchangeable dispense reservoir
    ÷ No need of sensor systems
    ÷ A weighing scales for all measurements
    ÷ 100% consumption of the resist from the bottle
    ÷ Incl. suck-back valve
    ÷ Programmable dispense rate & speed
    ÷ Programmable automatic refilling and de-bubble systems
    ÷ Display of the actual fill level


 Additional Info

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Please indicate which industries/technologies your company serves
MEMS, Semiconductor

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