Palomar Technologies

2728 Loker Ave W
Carlsbad,  CA  92010

United States
https://www.palomartechnologies.com
  • Booth: 5953


Die attach, wedge, wire bond demos & more in booth #5952!

Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved production quality and yield, reduced assembly times, and rapid ROI.

Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services.

Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore and China. For more information, visit: http://www.palomartechnologies.com


 Press Releases

  • Specifically designed to deliver the highest quality electronic packaging for power modules in automotive and commercial applications

    Carlsbad, CA – May 2, 2019 – Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, announced that SST Vacuum Reflow Systems, a wholly owned subsidiary of Palomar Technologies, has launched the SST 8300 Series Automated Vacuum Pressure Soldering System. The series, consisting of single and triple chamber systems provides a highly reliable solder connection with a better than industry standard void rate – a key to delivering high-reliability power modules for automotive and commercial applications.

    A.J. Wilson, President of SST Vacuum Reflow Systems and CMO for Palomar Technologies commented, “The electric vehicle market is exploding and one key to the successful rollout is mass availability of affordable and reliable power modules. In addition to higher volumes, power modules are expected to be more efficient and to be able to operate under more stressful conditions, such as higher temperatures and more power cycles. Our new automated vacuum pressure soldering system succeeds in providing both high volume and high reliability for the assembly of power modules.”

    The SST 8300 Series Automated Vacuum Pressure Soldering System differs from current systems on the market by utilizing SST’s unique system of applying both vacuum and gas pressure to achieve an extremely low void ratio for the soldering interface of key components inside a power module, especially for DBC-to-baseplate soldering. The power module market is actively seeking a flux-free solder process that achieves low void rates, which provide for higher reliability and longer life. Other industry segments with a demand for highly reliable power modules include power converters for wind turbines, photovoltaic solar energy systems, and other renewable energy applications, as well as industrial motor controls and large scale medical devices. Specific applications include: IGBT/SiC/GaAs/GaN die attach, CPV solar cell assembly, die attach for pressure sensors, hermetic sealing of high-reliability packages, high intensity LED attach, hermetic sealing of IR image sensors, copper clip soldering, high power laser module assembly, and multilayer ceramic capacitors.

    Other key benefits of the 8300 Series include:

    1. Automated high-volume production vacuum pressure soldering system
    2. Enables low-void solder connections with preforms or with solder paste
    3. Offers maximum flexibility for processing a wide range of solder alloys and other alternative interconnect materials
    4. Each chamber of the SST 8303 runs a complete process allowing multiple processes to be run in parallel
    5. Flexible configuration for any production line: single (8301) or triple (8303) chamber
    6. Oxide removal technology using formic acid or forming gas

    More information on the SST 8300 Series Automated Vacuum Pressure Soldering System can be found at: SST 8300. The new system can be seen at the SMTconnect exhibition in Nuremburg, Germany from May 7 – 9, 2019.  Palomar Technologies and SST Vacuum Reflow Systems are located in booth #4A-347.

    About Palomar Technologies
    Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved production quality and yield, reduced assembly times, and rapid ROI.

    With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services.

    Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore and China. For more information, visit: http://www.palomartechnologies.com

    Media Contact:

    Rebecca Janzon, Director of Marketing Communications

    Palomar Technologies

    Email: rjanzon@bonders.com

    Mobile: 760-409-7453


 Products

  • Palomar 6532HP Die Bonder
    The Palomar 6532HP 1.5 Micron Die Bonder was designed for the demands of assembling photonics packaging (VCSEL and photodiode). Combining high volume and high precision into a unique dual head parallel processing solution for increased throughput....

  • The Palomar 6532HP Die Bonder has been specifically designed for the demands of assembling photonics packaging, especially VCSEL and photodiode packaging within the Photonics market. The photonics market is demanding both high volume but also precision with little margin for error as components are assembled in multiple layers. The 6532 combines both high volume and high precision into a unique dual head solution with parallel processing. A high volume die presentation station is combined with a high precision bonding station with 1.5 micron accuracy to automate die presentation for increased bonding throughput.

    Unlike other solutions, the presentation station offers a large and flexible work area enabling a range of presentation options from die ejectors for 4” to 8” wafers, 2” and 4” waffle packs, tape feeders and a number of custom stages.

    The high precision bonding station offers a wide range of bonding options from pulse heat, steady state eutectic attach, in-Situ UV cure, epoxy daubing and dispense and custom stages.

    The 6532HP includes Palomar’s unique pattern recognition software, VisionPilot®, which maximizes throughput by using geometric pattern machining technology to reliably and accurately locate parts that are randomly oriented or have grey-scale variations by using state-of-the-art visioning and pattern recognition not tied to a traditional pixel-grid.

    Engineered to enable Industry 4.0 communications, the 6532HP can be integrated into any assembly line and is leading the way in photonics packaging assembly.

    The Palomar 6532HP Die Bonder enables users to increase through-put and maintain a high level of accuracy when assembling photonics packages, especially VCSEL and photodiodes.  The large and flexible presentation station offers users the ability to process multiple different types of packages using only one machine, including: lasers, photo diodes, capacitors, PD arrays, LD arrays, TOSA/ROSE, receivers, transceivers, modulations, AOC, to name a few.

  • SST 8300 Series Automated Vacuum Pressure System
    The SST 8300 Series is an automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure....

  • The SST 8300 Series Automated Vacuum Pressure Soldering System is specifically designed to deliver the highest quality electronic packaging for power modules, the system provides a highly reliable solder connection with a better than industry standard void rate – key to delivering high reliability power modules for automotive and commercial applications.

    The 8300 Series utilizes SST’s unique system of applying both vacuum and gas pressure to achieve an extremely low-void rate for the soldering interface of key components inside a power module, especially for DBC-to-baseplate soldering.  

    Featuring conveyor belts and a Cartesian gantry, the system provides high volume, high reliable packages through precise control of the soldering process. Available with a single or triple chamber, the system allows for heating up to 500°C and fast cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig using the QuikCool™ cooling unit.

    Key benefits of the 8300 Series include:

    Automated high-volume production vacuum pressure soldering system
    Enables low-void solder connections with preforms or with solder paste
    Offers maximum flexibility for processing a wide range of solder alloys and other alternative interconnect materials
    Each chamber of the SST 8303 runs a complete process allowing multiple processes to be run in parallel
    Flexible configuration for any production line: single (8301) or triple (8303) chamber
    Oxide removal technology using formic acid or forming gas


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
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Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Other, Photovoltaic, Power Semiconductors, Semiconductor, Sensors

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