Applied Microengineering Ltd. (AML)

Unit 8, Library Avenue,
Harwell Oxford
Didcot,  Oxfordshire  OX11 OSG

United Kingdom
http://www.aml.co.uk
  • Booth: 6362

AML unique in-situ Aligned Wafer Bonding Machines & Services

AML manufactures unique, in-situ Aligned Wafer Bonding systems.

The AWB systems offer the versatility to perform in-situ aligned bonding of 2” to 8” wafers using a wide range of techniques including direct, anodic, eutectic, adhesive, thermocompression, solder and glass frit.

AML’s unique in-situ alignment and process capabilities also enable chemical preparation (for example, oxide removal in Cu-Cu bonding) or activation of the bonding surfaces within the bonding chamber, immediately before alignment and wafer contact, without exposure to air between stages.

  • In-situ alignment to 1um accuracy, post-bond.
  • Confirm alignment immediately before bonding via in-situ optics
  • No contact/contamination of bond surfaces with flags
  • Large wafer separation – up to 30mm
  • In-situ surface preparation

Flexibility for R&D, throughput and automation for volume production.

Applications in MEMS, IC, & III-Vs.

With over 25 years’ experience in bonding and MEMS fabrication, AML offers a complete package – aligner bonding systems with bonding process know-how and in-house support from our BONDCENTRE application lab.


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LED/solid state lighting, MEMS, Power Semiconductors, Semiconductor, Sensors

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