July 12-14, 2016
San Fransisco, CA
PVA TePla specializes in wafer growth and processing equipment including CZ Crystal Furnaces, SiC growers, Plasma Systems (single wafer, batch or strip- inline type), Wafer Metrology and Scanning Acoustic Microscopes. Our company serves multiple markets including Power Device, HBLED, MEMS, 3DIC, OLED & Solar .
Our unique equipment is used for the following applications:
Front End applications include photo resist ashing & descum, polymer and SU8 or sacrificial layer removal for MEMS devices. Pre-Assembly solutions include stress relief, and Chip Side Healing (CSH) for 3DIC/ultra thin wafer technologies. Back End Packaging applications include pre-wire bonding, pre-encapsulation cleaning, surface activation of Flip Chips, stacked dies, MCM, advanced Cu lead frames and descum processes used in Wafer Bumping. Wafer metrology equipment allows for processing of substrates up to 450mm: (a) stress in Si, (b) ion implantation uniformities,(c) tracing of contaminants on Si via VPD (vapour phase decomposition) ICP mass spectrometry and (d) scanning acoustic microscopy for defect analysis of pre and post packaged devices.