Applied Microengineering Ltd. (AML)

Unit 8, Library Avenue,
Harwell Oxford
Didcot,  Oxfordshire  OX11 OSG

United Kingdom
  • Booth: 6362

AML unique in-situ Aligned Wafer Bonding Machines & Services

AML manufactures unique, in-situ Aligned Wafer Bonding systems.

The AWB systems offer the versatility to perform in-situ aligned bonding of 2” to 8” wafers using a wide range of techniques including direct, anodic, eutectic, adhesive, thermocompression, solder and glass frit.

AML’s unique in-situ alignment and process capabilities also enable chemical preparation (for example, oxide removal in Cu-Cu bonding) or activation of the bonding surfaces within the bonding chamber, immediately before alignment and wafer contact, without exposure to air between stages.

  • In-situ alignment to 1um accuracy, post-bond.
  • Confirm alignment immediately before bonding via in-situ optics
  • No contact/contamination of bond surfaces with flags
  • Large wafer separation – up to 30mm
  • In-situ surface preparation

Flexibility for R&D, throughput and automation for volume production.

Applications in MEMS, IC, & III-Vs.

With over 25 years’ experience in bonding and MEMS fabrication, AML offers a complete package – aligner bonding systems with bonding process know-how and in-house support from our BONDCENTRE application lab.

 Additional Info

New Exhibitor:
New Products:
Displaying Equipment:
Product Demonstrations:
Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Power Semiconductors, Semiconductor, Sensors

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".

For Technical Support with this webpage, please contact support.