Onto Innovation

16 Jonspin Road
Wilmington,  MA  01887

United States
  • Booth: 1127

Providing high-value process solutions for the semi industry

Rudolph Technologies collaborates with its customers around the globe to develop innovative, data-driven solutions that increase the yield and profitability of their microelectronics manufacturing operations. Rudolph’s comprehensive, state-of-the-art inspection, measurement, data analysis and lithography solutions for semiconductor manufacturing and advanced packaging processes accelerate product and process development, increase yields and reduce costs to enable its customers to be first-to-market with premium products at premium prices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.


  • Dragonfly G2 Inspection System
    Combining 2D and 3D technologies to detect yield-robbing defects and measure features critical for today's packaging technology, the Dragonfly G2 system will reset the industry's expectations for throughput, accuracy and reliability....

  • The Dragonfly™ G2 system combines 2D and 3D technologies to detect yield-robbing defects and measure features critical for today’s packaging technology. 2D imaging technology provides fast, reliable inspection for defects down to one micron. Rudolph’s patented Truebump™ Technology combines multiple 3D metrology techniques to deliver 100% bump height. This new technology is the foundation of Rudolph’s products designed to offer fast throughput, increased brightfield and darkfield sensitivity and solves site alignment challenges for large die. The Dragonfly G2 system now offers Clearfind™ Technology for non-visual residue detection.

    The Dragonfly G2 system is tightly integrated with control and analytical software for real-time analysis and review, IR defect review, while also providing offline review options. When massive amounts of bump data are generated during inspection, users now have the analytical tools to visualize data, correct process variations and improve yields.

  • JetStep Lithography System
    The JetStep Series fulfills emerging needs for the lithography challenges of advanced packaging. Back-end manufacturers are choosing to move from aligners to steppers to meet these requirements....

  • The JetStep Lithography system features a large field of view to improve exposure efficiency and throughput. The system is unique in its ability to handle a wide range of substrates and accommodate substrate warp. These and other purpose-designed features, such as on-the-fly auto focus and a large automatic magnification compensation range, provide ways to increase throughput and maximize yield in advanced packaging applications that are unavailable from lithography tools designed for front-end processes or conventional packaging applications. Designed for advanced packaging applications: WLCSP, solder bump, gold bump, Cu pillar bump, RDL/UBM, eWLB/Fan-out, TSV, interposers, non-standard substrates. Available for wafers or panels.

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