Semiconductor Equipment Corporation

5154 Goldman Ave
Moorpark,  CA  93021

United States
  • Booth: 5873

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SEMICONDUCTOR EQUIPMENT CORP. Manufacturer and distributor of manual, semiautomatic, and automatic equipment for the Photonics, Semiconductor, MEMS, SMT and Hybrid Industries. Back end products include flip-chip bonders, ultrasonic die bonders, laser diode bonders, eutectic die bonders, manual pick & place, epoxy die bonders, die rework, dicing tape, manual and automatic dicing tape applicators, UV tape curing system, backgrinding tape, backgrinding tape applicators, backgrinding tape peelers, and die ejectors. Front end products include semiautomatic and fully automatic cassette, SMIF, RSP, FOSB, FOUP, and EUV pod cleaning systems.


  • Model 365 UV Exposure System
    Cures Most UV Tapes in 5 Seconds Revolutionary new design cures UV tapes quickly and uniformly, features a long life light source and handles all size wafers up to 300mm. Programmable N2 Purge and exposure time. Programmable UV intensity. ...

  • Model 365 Capabilities:

    · Cures most UV tape in 5 seconds

    · Large exposure area cures up to 300mm wafers.

    · Film Frame masks available.

    · Programmable N2 purge and cure time

    · Touch screen control

    · Safety interlock to prevent operator exposure to UV light

    · Self diagnostic (alarm if LED fails, identifies faulty LED module)

    · 10,000 hour LED life

    · Generates no ozone

    · Cooling fans temperature controlled

  • Model 865 Flip Chip Bonder
    The Model 865 Flip Chip die bonder is ideal for R & D and low volume production. Applications include solder and gold bumped flip chip, AuSn eutectic, thermosonic, thermocompression and epoxy die bonding....

  • Specifications

    · Die sizes up to 50mm square.

    · 0.5 micron placement accuracy.  (+/-0.5 micron depending on application).

    · Magnification up to 800x.

    · Viewable area 50mm square (with optional X-Y motorized viewer).

    · New fail safe bond head design and efficient heater.

    · Stages 50mm & 100mm square standard. (other sizes and shapes available).

    · Stage temperatures to 450º C (depends on stage selected).

    · Temperature ramp rate for 50mm rapid heat. stage is 20º/sec.  Cover gas included.

    · Bond head temp to 400º C. (depends on bond head selected).

    · Bond load 10g to 10Kg (depends on bond head selected).

    · Precision hot gas to 650º C for spot heating.

 Additional Info

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LED/solid state lighting, MEMS, Photovoltaic, Plastic/organic/flexible electronics, Power Semiconductors, Semiconductor, Flexible and Printed Electronics-, Sensors

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