SET CORPORATION SA

131 Impasse Barteudet
Saint-Jeoire,  Haute-Savoie  74490

France
http://www.set-sas.fr
  • Booth: 6365


Discover SET high post-bond accuracy FLIP-CHIP BONDERS!

Founded in 1975, SET - Smart Equipment Technology - based in Saint-Jeoire, France, is a world leading supplier of High Accuracy Flip-Chip Bonders (Die-to-Die and Die-to-Wafer).

With more than 340 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its Flip-Chip Bonders.

The SET Bonders adapt to all main bonding techniques: fluxless reflow, adhesive joining compression and thermosonic.

SET’s newest generation of bonder, the ACCµRA family, guarantees the highest bonding accuracy (± 0.5 µm) and quality for the most demanding applications: image sensors, 3D IC with high density TSV, MEMS and optoelectronics applications... 

SET encompasses a subsidiary in North America and offers a comprehensive product portfolio of Flip-Chip Bonders for fast growing markets and serving clients through a global network of representatives and in-depth customer trainings.

Discover our range of FLIP-CHIP BONDERS: ACCµRA100, ACCµRA OPTO, ACCµRA M and ACCµRA Plus!

www.set-sas.fr

 Products

  • ACCµRA100
    The ACCµRA100 is a semi-automatic flip-chip bonder that guarantees +/- 0.5 µm post-bond accuracy....

    • Its flexibility makes it ideal for developing a wide range of applications.

    The ACCµRA100 combines high precision, accessibility and cost-effectiveness.

    It is the perfect equipment for universities and R&D institutes.

  • ACCµRA M
    The ACCμRA M is a manual flip-chip bonder that allows ± 3 μm post-bond accuracy. This equipment permits to align manually the components with a high level of precision....

    • The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.

    The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities.

    It is the perfect equipment for universities and R&D institutes.

  • ACCµRA Plus
    ACCμRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode....

    • It is suitable for reflow and thermocompression processes.

    ACCμRA Plus combines high precision, flexibility and short cycle time.

    It is dedicated to production for Optoelectronic and Silicon photonics applications.

 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which industries/technologies your company serves
MEMS, Semiconductor

Categories

200 Packaging and Assembly Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Hot Embossing System
  • Litho for WLP: Bumping; 3D Interconnect Aligners
  • Wafer Level Bonders
    • 204 MEMS Equipment
  • Wafer Level Bonders
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 701 Manufacturing Services or Consulting
  • Assembly

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