Singulus Technologies AG

Hanauer Landstrasse 103
Kahl am Main,  Bavaria  63796

Germany
http://www.singulus.de
  • Booth: 6253


SINGULUS TECHNOLOGIES - Innovations for New Technologies

SINGULUS TECHNOLOGIES - Innovations for New Technologies

SINGULUS TECHNOLOGIES is an engineering company and develops and builds machines for economic and resource-efficient production processes. The range of use of the machines built by SINGULUS TECHNOLOGIES include vacuum thin-film and plasma coating, wet-chemical cleaning and etching processes as well as thermal processing technology. For all machines, processes and applications SINGULUS TECHNOLOGIES utilizes its know-how in the areas of automation and process technology in order to provide additional, attractive work areas with innovative products next to the existing application areas of Solar, Semiconductors and Optical Disc.

SINGULUS TECHNOLOGIES is a renowned manufacturer of advanced thin-film deposition and wet processing equipment for magnetics, MRAM, thin-film head, and other semiconductor applications. The systems offer a reliable deposition of ultra-thin metallic and insulating films down to a thickness of one nanometer and below and stacks of such films with very precise material thickness and high uniformity specifications.


 Products

  • ROTARIS
    ROTARIS Universal Vacuum Sputtering System for Semiconductior Applications & more...

  • Universal Sputtering System

    The ROTARIS ultra-high vacuum system is a modular platform for fast, precise and fully automated thin-film sputter deposition. The ROTARIS is a bridge system for 200 mm and 300 mm wafer processing. Its main deposition chamber RSM (Rotating-Substrate-Module) can house up to 12 physical vapor deposition (PVD) cathodes with a target diameter of 100 mm.

    The ROTARIS design provides in particular a rotating substrate deposition technology with the additional capability to tilt the substrate. Additional features are “Co-sputtering” with up to four cathodes, DC-, pulsed DC-, RF-sputtering, wafer heating, and an in-situ aligning magnetic field. The installation of an ion source as alternative equipment allows for surface treatment and smoothing, ion milling and side wall cleaning.

    Four additional different process modules are available to configure a ROTARIS system according to customer needs to cover their challenging applications. These modules include industry proven modules like the Oxidation-Process-Module (OPM), Pre-Clean-Module (PCM), Combi-Process-Module (CPM) and Static-PVD-Module (sPVD-M).

    ROTARIS Basic

    ROTARIS Basic sputtering system for processing up to 200 mm wafer.

    Example of configuration:

    • 1x Rotating-Substrate-Module RSM
    • 1x Manual wafer load lock

    ROTARIS Advanced

    ROTARIS Advanced sputtering system with additional modules for processing up to 200 mm wafer.

    Example of configuration:

    • 1 x Rotating-Substrate-Module RSM
    • 1 x Combi-Process-Module CMP
    • 1 x MX400 Central-Transport-Module CTM

    ROTARIS Diversity

    ROTARIS Diversity sputtering system with six modules for advanced processing up to 200 mm wafer.

    Example of configuration:

    • 3 x Rotating-Substrate-Module RSM
    • 1 x Combi-Process-Module CMP
    • 1 x Small-Thermal-Process-Module sTPM
    • 1 x MX700 Central-Transport-Module CTM

  • Wet Processing
    Wet Process Systems for up to 300 mm Semiconductor Applications...

  • High-end products in semiconductors like WAFER, MEMS and MRAM. Product range started with manual wet stations for R&D, semi-automated systems and up to fully automated tools for the chemical surface treatment like cleaning, etching and drying.

    • Manual Wet Process Stations
    • Semi- and Fully Automated Wet Process Stations
    • Quartztube- and Part-Cleaning Stations
    • Total Metal Free Working Stations
    • Special Customer Specified Units
    • Chemical Supply Systems (pump or pressure systems)
  • TIMARIS
    TIMARIS - Vacuum Nano Depostion Platform for Semiconductor & Magnetic Storage...

  • TIMARIS - Vacuum Nano Depostion  Platform for Semiconductor & Magnetic Storage

    SINGULUSTechnologies has already established and qualified the second generation of the TIMARIS PVD Cluster Tool platform in the market and is offering a complete portfolio of process modules for different applications.

    Semiconductor

    • MRAM
    • STT-RAM
    • Sensors (GMR, TMR, other)
    • Ferro magnetics
    • In-circuit Inductors
    • Ultra thin-film deposition

    Thin-Film Heads (TFH)

    • Magnetic high moment films
      (writer material)
    • TMR (reader material)
    • GMR (reader material)
    • Deposition of seed and gap layers

    As of today, more than ten process modules are available to configure a TIMARIS system according to customer needs. These modules include the Multi-Target-Module (MTM), Oxidation-Process-Module (OPM), Pre-Clean- Module (PCM), Combi-Process-Module (CPM), Four-Target-Module (FTM) and Static-Deposition- Module (SDM) as well as the Rotating-Substrate- Module (RSM). The RSM is the core module of the ROTARIS platform, our sputtering system for special R&D applications.

    The TIMARIS PVD modules (MTM, FTM, SDM and RSM) incorporate the full scope of sputtering techniques as: DC magnetron sputtering, pulsed DC magnetron sputtering and RF magnetron sputtering as well as combinations of these modes are selectable by recipe.

    All TIMARIS applications require the deposition of ultra-thin metallic and insulating films and film stacks down to a thickness of one nanometer and below with very precise material thickness and high uniformity specifications.

    The MTM and the FTM are the key components of the TIMARIS platform; the MTM incorporates the Linear Dynamic Deposition (LDD, US patent US 7,799,179 B2) technology in combination with ten sputter targets in one vacuum chamber.

    The FTM module uses Linear Dynamic Deposition in combination with up to four cathodes. The LDD technology is especially designed for deposition of ultra-thin films, magnetic films, high-quality metallic, conductive and insulating films and is the key to deliver world class material uniformity across large wafer sizes, combined with an exceptional precise control of ultra-thin layer thickness down to 1 % of a nanometer.


 Additional Info

New Exhibitor:
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New Products:
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Displaying Equipment:
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Product Demonstrations:
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Please indicate which industries/technologies your company serves
MEMS, Photovoltaic, Semiconductor, Sensors

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