CyberOptics Corporation

5900 Golden Hills Drive
Golden Valley,  MN  55416

United States
http://www.cyberoptics.com
  • Booth: 5769


Hope to see you at booth 5769!

CyberOptics, the global market leader in wireless semiconductor measurement devices for chamber gapping, leveling, wafer handoff teaching, vibration, airborne particle and relative humidity measurement, including launching its new WaferSense® Auto Vibration and Leveling Sensor™ (AVLS3) with CyberSpectrum software.

Semiconductor fabs and OEMs value the accuracy, precision and versatility of the WaferSense and ReticleSense measurement portfolio to enable improvements in fab yields and equipment uptime. 

CyberOptics will also be showcasing the NanoResolution MRS 3D Sensor, a high precision optical sensor for inspection, powered by Multi-Reflection Suppression Technology. 

CyberOptics Corporation (NASDAQ: CYBE) is a leading global developer and manufacturer of  high-precision sensing technology solutions. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high-precision 3D sensors. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations in through its facilities in North America, Asia and Europe.


 Press Releases

  • Minneapolis, Minnesota — June 2019 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON West, July 9-11, 2019 in booth #5769 at the Moscone Center in San Francisco, CA. During the show, the company will launch its new WaferSense® Auto Vibration and Leveling Sensor™ (AVLS3) with CyberSpectrum software. Semiconductor fabs and OEMs value the accuracy, precision and versatility of the WaferSense AVLS3 – The most efficient and effective wireless measurement device for leveling and vibration.

    At only 3.5mm, AVLS3 can travel with ease to most fab locations where a wafer travels. The Chemically Hardened Glass (CHG) substrate enables smooth wafer handling and improved vacuum chucking.

    With long-range wireless capability, AVLS3 combined with new, easy-to-use CyberSpectrum software, collects and displays both leveling and vibration data simultaneously for fast equipment set-up, alignment and real-time equipment diagnostics. 

    “Engineers In the front-end of the fab can speed equipment qualification, shorten equipment maintenance cycles, lower equipment maintenance expenses and enhance process uniformity,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics Corporation, “As with other WaferSense devices widely used across fabs world-wide, AVLS3 can significantly improve yields and tool uptime.”

    Additionally, for mid-end and advanced packaging inspection and measurement, CyberOptics will demonstrate the new proprietary NanoResolution Multi-Reflection Suppression (MRS) sensor technology that meticulously identifies and rejects multiple reflections caused by shiny components and mirror-like surfaces. Effective suppression of multiple reflections is critical for highly accurate measurements. 

    Offering an unparalleled combination of high accuracy, high resolution and speed, MRS sensors are widely used for inspection and measurement in the SMT, semiconductor and metrology markets. The new 3- micron NanoResolution MRS sensor enables metrology grade accuracy with superior 100% 2D and 3D inspection performance for features as small as 25-micron.

    Further, it is two to three times faster than alternate solutions in the marketplace. With data processing speeds in excess of 75 million 3D points per second, the NanoResolution MRS sensor delivers throughput greater than 25 wafers (300mm) per hour. 100% 2D and 3D inspection can be completed simultaneously at high speed, versus an alternate, slow method that requires two separate scans for 2D and 3D, and only a sampling of a few dies of the 25 wafers. 

    This best-in-class MRS sensor technology is ideally suited for the inspection of CPU sockets, IC package, solder balls and bumps, copper pillars, and other advanced packaging and mid-end semiconductor applications where high precision and speed are needed.

    For more information, visit www.cyberoptics.com. 

    About CyberOptics CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics’ sensors are used in SMT, semiconductor and metrology markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

    Statements regarding the company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; the timing of orders and shipments of our products, particularly our 3D MRS-enabled AOI systems; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics and semiconductor markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; the market acceptance of our SQ3000 3D CMM system, products for semiconductor mid-end and advanced packaging inspection applications and CyberGage360 product; costly and time consuming litigation with third parties related to intellectual property infringement; and other factors set forth in the company’s filings with the Securities and Exchange Commission.

    # # #

    For additional information, contact:

    Carla Furanna

    Head of Global Marketing, CyberOptics

    952-820-5837, cfuranna@cyberoptics.com

  • Minneapolis, Minnesota — June 2019 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at SEMICON West, at the Moscone Center in San Francisco, CA on July 10 in the North Hall E, Room 20 at 11:15am. The company will also exhibit at the show in booth #5769.

    Tim Skunes, VP of R&D at CyberOptics, will present the technical paper ‘High precision sensing technology for semiconductor inspection and measurement applications.’ The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels for higher bandwidth and lower power consumption. In addition to the increased complexity, shiny and mirror-like surfaces present inspection challenges.

    For mid-end and advanced packaging inspection and measurement, CyberOptics will demonstrate the new proprietary NanoResolution Multi-Reflection Suppression (MRS) sensor technology that meticulously identifies and rejects multiple reflections caused by shiny components and mirror-like features. Effective suppression of multiple reflections is critical for highly accurate measurements. 

    Offering an unparalleled combination of high accuracy, high resolution and speed, MRS sensors are widely used for inspection and measurement in the SMT, semiconductor and metrology markets. The new 3- micron NanoResolution MRS sensor enables metrology grade accuracy with superior 100% 2D and 3D inspection performance for features as small as 25-micron.

    Further, it is two to three times faster than alternate solutions in the marketplace. With data processing speeds in excess of 75 million 3D points per second, the NanoResolution MRS sensor delivers throughput greater than 25 wafers (300mm) per hour. 100% 2D and 3D inspection can be completed simultaneously at high speed, versus an alternate, slow method that requires two separate scans for 2D and 3D, and only a sampling of a few dies of the 25 wafers. 

    This best-in-class MRS sensor technology is ideally suited for the inspection of CPU sockets, IC package, solder balls and bumps, copper pillars, and other advanced packaging and mid-end semiconductor applications where high precision and speed are needed to improve yields, throughput and process control.

    For more information, visit www.cyberoptics.com. 

    About CyberOptics

    CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics’ sensors are used in SMT, semiconductor and metrology markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe. 

    Statements regarding the company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; the timing of orders and shipments of our products, particularly our 3D MRS-enabled AOI systems; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics and semiconductor markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; the market acceptance of our SQ3000 3D CMM system, products for semiconductor mid-end and advanced packaging inspection applications and CyberGage360 product; costly and time consuming litigation with third parties related to intellectual property infringement; and other factors set forth in the company’s filings with the Securities and Exchange Commission

    # # #

    For additional information, contact:

    Carla Furanna

    Head of Global Marketing, CyberOptics

    952-820-5837, cfuranna@cyberoptics.com


 Products

  • WaferSense® Auto Vibration and Leveling Sensor™
    Speed simultaneous vibration and leveling measurements with the new WaferSense® Auto Vibration and Leveling Sensor™ (AVLS3)...

  • Speed equipment qualification with wireless measurements

    - Collect and display acceleration, vibration and leveling data.

    - Use the AVLS3 with new CyberSpectrum™ software for real-time equipment diagnostics.

    - See the effects of calibrations in real-time, speeding equipment alignment and set-up.

    Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor.

    - Access more chambers with the thin 3.5mm form factor.

    - Enable smooth wafer handling and improved vacuum chucking with the new Chemically Hardened Glass (CHG) substrate.

    - Keep the process areas unexposed to the fab environment with vacuum compatible AVLS3.

    Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data.

    - Take the human element out of calibrating equipment with objective measurements for multiple applications in one.

    - Make the right adjustments time after time.

    - Receive early warning for impending equipment failures and optimize your preventative maintenance plans.

  • NanoResolution MRS Sensor
    High Precision Optical Sensor for for mid-end and advanced packaging inspection and measurement....

  • Metrology-Grade Accuracy with MRS Technology
    –– Sub-micrometer accuracy for features as small as 25 μm
    –– Accurately inspect shiny or mirror-like surfaces with sensor technology that rejects spurious reflections.
    –– Attain repeatable and reproducible measurements.

    Fast, Superior Inspection Performance
    –– Increase throughput with the MRS sensor that is 2-3X faster than alternate technologies, delivering greater
    than 25 wafers (300mm) per hour.
    –– Conduct 100% 2D and 3D inspection versus sampling only methods.
    –– Attain 2D and 3D measurements in the same scan vs. separate, time-consuming scans by alternate technologies.

    Versatility for Mid-End and Advanced Packaging Applications
    –– Inspect a wide range of applications including CPU sockets, solder balls and bumps, wafer bumps, copper
    pillars and other mid-end and advanced packaging applications.
    –– Achieve high speed, highly accurate, inspection and 3D metrology for critical packaging features including
    bump height, coplanarity, diameter and shape, relative location and variety of other measurements.


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
Yes
Product Demonstrations:
Yes
Please indicate which industries/technologies your company serves
Semiconductor

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