Royce Instruments, LLC

480 Technology Way
Napa,  CA  94558

United States
  • Booth: 5760

Please join us in booth 5760 to see a live demonstration of Royce's latest automatic die sorter, the AP+, configured with automatic top and edge inspection.  Specializing in low to medium volume applications requiring frequent process changeover, the AP+ has options available for no surface contact pick-up, bumped die, MEMS devices, thin/fragile die handling, etc.  Royce engineers are glad to discuss with you the latest bond test and die sorting challenges and solutions.


  • Royce AP+ Automated Die Sorter
    Die sorter to pick from wafer, waffle pack, Gel-Pak®, JEDEC tray, or custom fixture, and place to all the same options plus carrier tape. Options include die inversion, automatic inspection, and non-surface contact....

  • The new AP+ marks the latest generation of automated die sorter from Royce Instruments, designed to address the needs of engineers seeking a user-friendly flexible tool capable of handling the most varied and complex sorting requirements

    Choose from wafer on tape, waffle pack, Gel-Pak®, JEDEC tray or your own custom tray with or without a wafer map. 180 degree die inversion, optical inspection and a wide variety of output fixtures including placement to tape and reel are available. Full input to output die level traceability is maintained for all combinations of input and output fixtures.

    Quick change tooling allows a wide variety of processes to be handled on a single system. The non-surface contact edge grippers allow MEMs and optical devices with sensitive surfaces to be handled without touching or applying vacuum to the top of the device, while customizable eject heads and pick-up tools allow die as thin as 50 micron thick GaAs with air bridges and vias to be successfully processed. Integrated wafer mapping software allows wafers with multiple die sizes (multi-project/Pizza mask wafers) to be easily processed. With the wafer map file support option, customers can load their map file directly into the AP+, or the built-in map creator can be used to create a map for untested wafers.

    Now available is an optional, automatic inspection package for visual inspection of die surface and edge.  Inspection criteria and binning is user customizeable with sub-micron resolution.  Visit Royce in booth 5760 to see a live demonstration.

 Additional Info

New Exhibitor:
New Products:
Displaying Equipment:
Product Demonstrations:
Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Other, Photovoltaic, Plastic/organic/flexible electronics, Power Semiconductors, Semiconductor, Flexible and Printed Electronics-, Sensors
If you checked Other, please indicate your Company Industry
Medical, Aerospace, Defense, etc.

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".

For Technical Support with this webpage, please contact support.