FPGA Field Programmable Gate Array & CCGA Column Grid Array
Ceramic Column Grid Array (CCGA) typically found in mil/aerospce/defense applications.
Columns absorb large stresses due to the inherit mismatch of the material's coefficient of temperature expansion (CTE) between a ceramic module and a plastic FR4 (or polyimide) circuit board.
Temperature excursions stretched and squeezed 2.5mils (63um), or more, from corner to corner as the temperature swings 100 degrees Celsius.
The solution for overcoming CTE mismatching is to replace solder balls with solder columns, making a device known as a Ceramic Column Grid array (CCGA).
Solder columns are compliant and absorb stresses caused by stretching and pulling in applications involving high vibration, shock and varying temperatures.
CCGA have been used for decades by well known chip makers such as Xilinx, Atmel and Microsemi (previously Actel), just to name a few.
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