Plot 18 & 19, Technoplex, Medan Bayan Lepas,
Taman Perindustrian Bayan Lepas,
Georgetown,  Penang  11900

  • Booth: 5763

Pentamaster - a global leader in providing WORLD CLASS Automation Solutions and Services to multinational manufacturers mainly in Semiconductor, telecommunications, Automotive and consumer electronics sectors spanning APAC, North America and Europe.

We are One-Stop Solution Centre offers full range of services from design consultation to system implementation, training, maintenance and upgrading.

With more than 25 years of experience in dealing with high-end technologies companies across worldwide market, we are confident to compete in terms of manufacturing flexibility, quality services, cost effective solutions, timely delivery and are positioned to greater growth.

Specialties – Semiconductor & MEMS Sensor Test Solutions, Optics and Photonics Sensor Test Solutions, Automated Vision Inspection Solutions, Assembly and Process Solutions, Customized Solutions, LED Burn-in and Test Solutions, Vision Retrofit, Factory Automation Solutions and Hospital and Nursing Home Equipments.


  • Optical VCSEL Wafer Tester (Trooper-X03)
    Optical VCSEL Wafer Tester (Trooper-X03) is our next generation cutting edge full turnkey solution designed to test the electrical & optical characteristics of packages such as VCSEL, LED and LIDAR in wafer-level....

  • Pentamaster Trooper-X03 is an innovative wafer level optical test system for VCSEL, EEL, and Laser Diodes, It integrates with LIV test, Far Field test, and Near field test systems.

    LIV test analyse the characteristic of optical and electrical corresponding power to eliminate the reject and faulty dice. Far field test analyse for characteristic of projected beam screen the uneven power distribution and hotspot dice. While Near field test enable test to remove reject emitter and M2 measurements. With these test functions in place, tested wafer will ensure only good dice to flow down to the next stage of manufacturing, eliminating waste and safe cost of multiple processes.

    Test system is capable to drive current up to 3A at 100us pulse to reduce heats generated from wafer, enable test at high precision and stability. Thermal controller wafer chuck is build in to enable test at low temperature from 5⁰C to raised temperature of 85 ⁰C.

    Wafer chuck on X,Y,Z, and Rotation stage is built on top of solid granite platform with anti-vibration system enable stable and reliable thin wafer handling. While load control applied on probe pins ensure ideal test contact established.

    Trooper-X03 is a comprehensive all in one tester enable screening at wafer level ensure only good dice to flow down to next phase of manufacturing process, eliminate waste of manufacturing cost, and ensure product excellent quality.

  • Wafer-Level VCSEL/LED Burn-in Test System (ZETA)
    It is a full turnkey solution to probe & burn-in VCSEL, LIDAR and LED substrate in wafer-level. The tester is capable of testing up to 7,200 DUTs at one go with a controlled temperature up to 135°C....

  • Zeta is the latest wafer-level VCSEL, LIDAR and LED burn-in test handler. It accommodates up to 2 wafers in a compact foot print consisting of 7,200 independent driver channels, voltage/current measurement, temperature monitoring, wafer probers and thermally controlled water cooled wafer chuck programmable up to 130degoC.

    The 7,200 independent drivers available are constant DC current sources or pulsed. Pulsed mode is particularly useful in VCSEL and LIDAR where the drive current is higher. The current ranges from 20mA up 1.5A per channel. Burn-in duration is programmable and the individual die voltage/current is measured at regular interval to be compared against set criteria. Wafer maps in .csv file are then generated for post burn-in processing.

    The application is to apply electrical and thermal stress to the target wafers to weed out infant mortality dice, therefore improve the quality and reliability of the known good dice.

    Wafer level burn-in improves the cost effectiveness of improving product reliability earlier in the manufacturing process without incurring packaging cost.

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LED/solid state lighting, MEMS, Power Semiconductors, Semiconductor, Sensors
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Semiconductor, telecommunications, Automotive and consumer electronics.

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