Hesse Mechatronics, Inc.

213 Hammond Avenue
Fremont,  CA  94539

United States
  • Booth: 6252

World leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, Hesse Mechatronics designs and manufactures high speed fine pitch/thin wire wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly, in addition to providing wire bonding services.

Wire Bonding Equipment

Hesse Mechatronics' high-speed, fully automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon).

Wire Bonding Services 

The company's wire and ribbon bonding services support early stage product development including heavy wire and ribbon bonding process support, development and production of prototypes and pre-production manufacturing in four applications and demonstration labs throughout the USA.

Wire Bonding Videos

Register to view our wire bond videos at www.wirebonddemo.com 


  • BJ855
    Fine Wedge and Ball Bonder...

  • Hesse Mechatronics has a BJ855 Wire Bonder that is capable of doing fine wedge (50 microns and smaller), fine ribbon (1x10 is the largest size) and ball bonding (Au). Our large work table is ideal for wafers as well as for large hybrids. Visit us in booth 6252 to see a live demonstration of the BJ855. 

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