Machine Vision Products. Inc

3270 Corporate View
Vista,  CA  92081

United States
https://www.machinevisionproducts.com
  • Booth: 6459


The Micro-electronics and Semiconductor Inspection Experts.

Machine Vision Products, Inc., will be demonstrating its Die Wire Metrology System (DWMS), Wafer Inspection and Semiconductor Automated Optical Inspection solution at the Semicon West exhibition. 

The DWMS (Die Wire Metrology System) has a diverse inspection toolbox providing the highest quality inspection capabilities for multiple locations in microelectronics and packaging lines.

With specialized material handling and tools MVP can typically inspect a UPH reaching up to 150.000 depending on the density of devices in a lead frame strip.

The high speed, high inspection quality solution provided by MVP puts it as a leader in these markets, that was, until recently, very dependent on manual inspection

MVP continues to lead the global inspection arena by developing all of their product offerings. With over 24 years of leadership, MVP is taking multiple steps to continue to provide the overall lowest cost of ownership when compare to any competitor globally. For additional information on this unique solution, please visit us at www.machinevisionproducts.com or visit us at Booth 6459


 Products

  • Semiconductor & Microelectronics Inspection - 850G
    MVP’s 850G inspection techniques include high-resolution telecentric imaging, multi-teir lighting, and 3D techniques to provide the maximum defect, and measurement capabilities for semiconductor and microelectronics inspection....

  • MVP’s 850G inspection techniques include high-resolution telecentric imaging, multi-teir lighting, and 3D techniques to provide the maximum defect, and measurement capabilities for Semicondictor, Microelectronics, Die and Wire Bond inspection. For in-line operations, single and dual lane options are also available to quickly process microelectronic assemblies.

    MVP also provide many material handling configurations for the 850G AOI system including magazine lifters, tray handling and other custom solutions. For in-line operations, single and dual lane options are also available to quickly process microelectronic assemblies.

  • Lead-frame Inspection - 2020
    MVP’s 2020 DWMS (Die Wire Metrology System) is a new dedicated lead frame inspection solution....

  • MVP’s 2020 DWMS (Die Wire Metrology System) is a new dedicated lead frame inspection AOI and uses advanced optic and handling solutions to provide the latest in Die and Wire-Bond inspection. Inspection techniques include high-resolution telecentric imaging, quad color lighting, and 3D techniques to provide the maximum defect, and measurement capabilities for Lead Frame, Die Epoxy, and Wire Bond inspection.

    MVP’s 2020 DWMS AOI system is configured as standard with integrated MVP leadframe magazine loaders and unloaders designed for error free operation at the highest of UPH demands.

  • Wafer Inspection - 850DW
    The 850DW provides a high speed, high performance, fully integrated Diced Wafer inspection solution....

  • The 850G DW provides a high speed, high performance, fully integrated Diced Wafer inspection solution. Capable of delivering an inspection potential of up to 12, 300mm Diced Wafers per hour the 850 DW meets the demands for the highest of throughputs.

    Introducing MVP’s integrated handling solutions the 850 DW can be configured with a single controller for loading, inspection and unloading actions and supports full touchless recovery. Alternative manual loading solutions are availible. MVP supply an integrated vacuum chuck configurable for multiple wafer sizes. Configurable electro-optic solutions provide performance inspection capabilities and full metrology capability.

    The 850 DW also provides for full process integration with downstream processes including defect maps and also comes with full Management Webreports generated by MVP’s AutoNetworker.


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
Yes
Product Demonstrations:
Yes
Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Photovoltaic, Plastic/organic/flexible electronics, Power Semiconductors, Semiconductor, Flexible and Printed Electronics-, Sensors

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