MRSI Systems

101 Billerica Ave
Building #3
North Billerica,  MA  01862

United States
https://www.mrsisystems.com/
  • Booth: 6163


MRSI Systems Die Bonding and Epoxy Dispensing Systems

MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com.   


 Press Releases

  • BILLERICA, Massachusetts, USA, August 20, 2018 – MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC).

    This expansion is in response to our customer’s request to take advantage of the field-proven performance of the flexible high speed MRSI-HVM3 platform, for their other essential packaging applications in photonics manufacturing which are high volume and high mix by nature.

    The new MRSI-HVM3P is the first major extension to the HVM3 family, equipped with inline conveyor for single fixture or multiple cassette inputs that can automatically transport large forms of carriers of the dies. This configuration is targeted at AOC or similar die-to-printed circuit board (PCB) applications, gold-box packaging, and CoC in fixture. The processes include eutectic, epoxy stamping, UV epoxy dispensing, and in-situ UV curing.

    “With these extensions to our successful HVM3 platform, MRSI Systems is now able to offer flexible high volume die bonding solutions, not just for CoC, but also for PCB and box levels of packaging to our customers in photonics, sensors and other advanced technology fields,” said Dr. Yi Qian, Vice President of Product Management of MRSI Systems. “This is another demonstration of MRSI’s commitment to provide critical solutions promptly in response to our customers’ needs,” concluded Mr. Michael Chalsen, President of MRSI Systems.
    Both MRSI-HVM3 and MRSI-HVM3P now carry the following options inherited from our long proven MRSI-M3 family: localized heating, flip-chip bonding, and co-planarity bonding. These options are increasingly critical for new applications such as 400G transceivers and silicon photonics.

    The MRSI-HVM3 product family delivers industry-leading speed, future-proof high precision (<3μm), and superior flexibility for true multi-process, multi-chip, high-volume production.

    The launch of the MRSI-HVM3P builds on the success of our first configuration launched last year, the MRSI-HVM3 for CoC, Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB) assembly using eutectic and/or epoxy stamping die bonding, which has proved to be the best-in-class die bonder with the leading speed, zero-time tool change between dies, and <3μm accuracy. The superior performance was enabled by dual head, dual stage, integrated “on-the-fly” tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations (see product launch press release August 14, 2017).
    MRSI Systems is exhibiting at China International Optoelectronic Expo (CIOE) with our partner CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 5-8, 2018 and ECOC (Booth #577) in Rome, Italy, September 24-26, 2018.
    For additional information, please contact:
    Dr. Yi Qian Vice President of Product Management, MRSI Systems Tel: +1 (978) 667-9449, e-mail: yi.qian@mrsisystems.com
    Time Zone: ET – Eastern Time
    Tobias Bülow Director IR & Corporate Communications, Mycronic
    Tel: +46 734 018 216, e-mail: tobias.bulow@mycronic.com
    Time Zone: CET – Central European Time
    The information in this press release was published August 21, 2018, at 09:00 am ET.


    About MRSI Systems
    MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com. MRSI Systems is part of the Mycronic Group.

    About Mycronic
    Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarter is located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic (MYCR) is listed at Nasdaq Stockholm. www.mycronic.com

  • MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3μm high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced photonics such as industrial lasers, optical fiber amplifications, lighting, and sensors. High power diode lasers are critical components for multiple markets and have seen a significant, continual rise in adoption with the explosion in new applications. The new MRSI-H3LD is equipped for speed with “on-the-fly” auto tool changer integrated on the bonding head for zero time tool change-over with ultrafast-ramp eutectic station for reduced cycle time. Combining both, MRSI-H3LD demonstrates the highest throughput in industry for the high power diode laser die bonding.

    “The new MRSI-H3LD product carries key technological building blocks from our field proven flexible high speed MRSI-HVM3 platform for industry leading throughput, superior flexibility, and future-proven 3μm placement accuracy. It enables our high power diode laser and other photonics customers to scale up their business,” said Dr. Yi Qian, Vice President of Product Management of MRSI Systems.

    MRSI-H3LD has a placement accuracy of <3μm (±3σ). The precision is achieved without sacrificing high speed or flexibility and helps high power diode laser manufacturing to achieve smaller offset between the front facets of laser diode and the front end surface of the submount. It is also equipped with self-leveling collets specially designed for large high power laser dies to achieve co-planarity between two bonded interfaces. MRSI Systems is exhibiting at CIOE with our partner CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 5-8, 2018 and ECOC (Booth #577) in Rome, Italy, September 24-26, 2018.

    For additional information, please contact:
    Dr. Yi Qian
    Vice President of Product Management, MRSI Systems
    Tel: +1 (978) 667-9449, e-mail: yi.qian@mrsisystems.com
    Time Zone: ET – Eastern Time
     
    Tobias Bülow
    Director IR & Corporate Communications, Mycronic
    Tel: +46 734 018 216, e-mail: tobias.bulow@mycronic.com
    Time Zone: CET – Central European Time

    The information in this press release was published August 28, 2018, at 09:00 am ET.

    About MRSI Systems
    MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com. MRSI Systems is part of the Mycronic Group.

    About Mycronic
    Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters is located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic (MYCR) is listed at Nasdaq Stockholm. www.mycronic.com
  • November 12, 2018

    MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China. MRSI will be offering local demonstrations of its 
    market leading MRSI-HVM3 die bonder and also die bonding applications using customer’s sample materials, by arrangement.

    This offers existing and prospective customers in China the opportunity to review the detailed performance capability of the MRSI-HVM3 in a local setting, supported by MRSI’s world-class local application engineers for a quick turn-around of product demonstration and die bonding sample building. The MRSI-HVM3 product family delivers industry-leading speed, future-proof high precision (<3 micrometers), and superior flexibility for true multi-process, multi-chip, high-volume production. The superior performance is enabled by 
    dual head, dual stage, integrated “on-the-fly” tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations.

    The MRSI-HVM3 is designed for specific applications including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB) assembly using eutectic and/or epoxy stamping die bonding. This also provides great opportunities to discuss with MRSI’s local process experts for solutions within the extended product configurations of HVM3e, HVM3P, H3TO, and H3LD. These configurations are based upon the same design as HVM3 but configured specifically for local top heating, inline conveyor CoB, AOC and gold-box packaging, WDM & EML TO-can packaging 
    and high power laser diode packaging, respectively.

    MRSI Systems Launches MRSI-HVM3P for New Applications MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market


    Contact MRSI Systems (sales@mrsisystems.com) to schedule a demo at the Shenzhen facility and learn about how MRSI’s assembly solutions can meet your specific application requirements.


    This is an important milestone for MRSI Systems allowing us to better serve our local Chinese market by offering timely and relevant demonstrations of our new expanded MRSI-HVM3 family of products.


    For additional information, please contact:

    Dr. Yi Qian Vice President of Marketing, MRSI Systems
    Tel: +1 (978) 667-9449, e-mail: yi.qian@mrsisystems.com Time Zone: ET – Eastern Time

    Tobias Bülow Director IR & Corporate Communications, Mycronic
    Tel: +46 734 018 216, e-mail: tobias.bulow@mycronic.com
    Time Zone: CET - Central European Time


    The information in this press release was published November 12, 2018, at 9 am ET.

    About MRSI Systems
    MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com.

    About Mycronic

    Mycronic is a Swedish high-tech company engaged in the development, manufacture 
    and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarter is located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic (MYCR) is listed at Nasdaq Stockholm. www.mycronic.com


 Products

  • MRSI-HVM3 Family High Speed 3-Micron Die Bonders
    The HVM3 family of products offers a range of high volume manufacturing solutions across the applications spectrum....

  • The HVM3 family of products offers a range of high volume manufacturing solutions across the applications spectrum. The MRSI-HVM3 product family delivers industry-leading speed, future-proof high precision (<3μm), and superior flexibility for true multi-process, multi-chip, high-volume production.

    The MRSI-HVM3 targets Chip-on-Carrier (CoC), Chip-on-Submount (CoS), Chip-on-Board (CoB) assembly and silicon photonics applications using eutectic and/or epoxy stamping die bonding.


    The MRSI-HVM3P targets Active Optical Cable (AOC) or similar die-to-printed circuit board (PCB) applications, gold-box packaging, and CoC in 
    fixture, silicon photonics. The processes include eutectic, epoxy stamping, UV epoxy dispensing, and in-situ UV curing.

    Both MRSI-HVM3 and MRSI-HVM3P carry the following options inherited from our long proven MRSI-M3 family: localized heating, flip-chip bonding, and co-planarity bonding. The family’s superior performance is enabled by 
    dual head, dual stage, integrated on-the-fly tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations.
     

    The ultra-fast MRSI-HVM3 family delivers the following outcomes for our customers:

    • Ultimate Speed for the Highest Throughput
    • Covers the spectrum of applications: CoC, CoS, CoB, silicon photonics, AOC or similar PCB applications, gold-box packaging, and CoC in fixture
    • Superior Flexibility for True Multi-die, Multi-process, Multi-product High Volume High Mix Production
    • High Precision (±3μm @ 3σ) for Better Yield and Future Higher Density Assembly​​
    • Proven Reliability for 24/7 Production

  • MRSI-705, 5 Micron Die Bonder
    The MRSI-705, 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly....

  • The MRSI-705 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform, with the largest installed base in the industry in advanced packaging. Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more.

    The MRSI-705 is built to meet the highest standards of reliability and dependability. It starts with an award-winning, industry standard platform with a day-in/day-out accuracy of 5 microns; achieved by leveraging the platform’s signature design features:

    • A solid granite platform supports the placement head from above, so that no mechanisms are cantilevered. All of this makes the MRSI-705 thermally and mechanically stable with extremely fast settling times and +/- 5 microns or better placement accuracy, a requirement for critical applications.
    • Minimized number of moving mechanical parts.
    • The major system X Y axes use zero force, ironless, actively cooled linear motors with high resolution linear encoders. Encoder scales have 0.1-micron resolution for fast, precise, closed-loop positioning. The linear motors deliver faster speeds (acceleration, deceleration and velocity), with better settling times and overall smoother motion.
    • Reliability is enhanced through the use of advanced air-bearing technology in the Z axis.

    Benefits:

    The MRSI-705 produces the following compelling business outcomes for customers:

    • Strongest ROIs in the industry – A well-established platform with an unmatched Cost of Ownership. Lifts up overall production efficiency.
    • Extended Machine Lifetime – Exceptional performance over time. Upgrade paths as new features are introduced.
    • Proven Manufacturing Readiness – A work horse with minimum downtime. Compelling reliability.
    • Configurable Asset – The MRSI-705 is an open platform that adapts to changing portfolios. Can handle complex multi-chip modules and other advanced assembly challenges with ease.

  • MRSI-H3 Family High Speed 3-Micron Die Bonders
    The H3 family of products offers a range of high volume manufacturing solutions across the applications spectrum....

  • The H3 family of products offers a range of high volume manufacturing solutions across the applications spectrum. The MRSI-H3 product family delivers industry-leading speed, future-proof high precision (<3μm), and superior flexibility for true multi-process, multichip, high-volume production.

    The new MRSI-H3TO targets manufacturing challenges driven by 5G wireless network roll out and the desire for ever increasing bandwidth, building the next generation of TO-can photonic devices, such as WDM & EML-TOs. Our new MRSI-H3TO die bonder is the first of its kind to address the multi-die and multi-process requirements, delivering industry leading throughput, superior flexibility, and future-proven 3μm placement accuracy.

    The new MRSI-H3LD product targets the fast growing markets using high power diode lasers and other photonics customers. It carries the following options inherited from our long proven MRSI-M3 family: localized heating, flip-chip bonding, and co-planarity bonding.

    The new MRSI-H3 family builds on the key technological building blocks featured in our field proven 
    high speed MRSI-HVM3 platform.
     

    The ultra-fast MRSI-H3 family delivers the following outcomes for our customers:

    • Ultimate Speed for the Highest Throughput for WDM/EML-TOs and High Power Pump Lasers

    • Covers the spectrum of applications: CoC, CoS, CoB, silicon photonics, AOC or similar PCB applications, gold-box packaging, and TO-TOSA/ROSA

    • Superior Flexibility for True Multi-die, Multi-process, Multi-product High Volume High Mix Production

    • High Precision (±3μm @ 3σ) for Better Yield and Future Higher Density Assembly

    • Proven Reliability for 24/7 Production


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
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