MicroAssembly Technologies Ltd.

19 Red Coat Lane
Plainville,  MA  02762

United States
  • Booth: 5680

Featuring the MAT 6200 Crossover Automatic Die-Attach System

MicroAssembly Technologies (MAT) provides economical high accuracy die attach and dispensing systems for assembling Semiconductor, Optoelectronic, Microelectronic Component and Aerospace components. MAT's 6400, our flagship platform, and the NEW 6200 Crossover, are extremely versatile Automatic Die-Bonders, employing an intuitive Windows Interface. Both support an expansive variety of assembly and packaging applications: MCM, COB, Flip Chip, Optical, Microwave, MEMS or Sensors. Concurrently picking from Wafers, Waffle or Gel-Packs, and Tape Feeders. Employing Epoxy or Silver Glass dispensing, heated bond-head and work-holder, they perform Eutectic, Ultrasonic or Adhesive die attach with 3-5 micron accuracy. Ideal for the High-Reliability Environments, these systems also shine in Development Labs or low-to-medium volume High-Mix packaging-assembly facilities. North American Distributor: EMA Sales & Marketing. Contact: Harvey Smith: 508-826-6033; e-mail: harvey@emasalesmarketing.com

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LED/solid state lighting, MEMS, Other, Power Semiconductors, Semiconductor, Sensors
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Military-Aerospace Microelectronics

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