Nikon Precision

1399 Shoreway Rd
Belmont,  CA  94002-4107

United States
  • Booth: 927

Please visit Nikon at SEMICON West booth #927 in South Hall

Since 1980, Nikon Corporation has been revolutionizing lithography with innovative products and technologies. The company is a worldwide leader in semiconductor lithography systems for the microelectronics manufacturing industry with more than 8,000 (semiconductor) lithography systems installed worldwide. Nikon offers the most extensive selection of production-class steppers and scanners in the industry. These products serve the semiconductor, flat panel display (FPD) and thin-film magnetic head (TFH) industries. The extensive Nikon product portfolio includes specialized lithography solutions for MEMS, LED, and packaging applications as well. Nikon Precision Inc. provides service, training, applications and technical support, as well as sales and marketing for Nikon lithography systems in North America. For more information about Nikon, access our website at


  • NSR-S635E and inline Alignment Station (iAS)
    The NSR-S635E ArF immersion scanner incorporates state-of-the-art technology to deliver unparalleled multiple patterning performance and productivity, and can be coupled with iAS to further enhance system capabilities....

  • The industry-leading NSR-S635E ArF immersion scanner leverages the proven Streamlign platform, incorporating the latest developments in lens, autofocus, alignment, and defectivity minimization technology to deliver unparalleled multiple patterning performance and productivity.

    The S635E has demonstrated world-class single machine overlay (SMO) of ~ 1 nm across across a single lot in precision mode, as well as five lot data below 1.4 nm (Avg. +3σ) in standard mode. The S635E can also be coupled with the Nikon inline alignment station (iAS) to further enhance scanner on-product overlay performance and productivity.

    The NSR-S635E can process up to 275 wafers per hour. In addition, nozzle innovations prevent immersion defects, while enhanced overlay and focus stability contribute to maximized tool productivity and fab daily output. These elements ensure world-class device patterning and optimum fab productivity to satisfy 5 nm node requirements.

  • LithoBooster
    The LithoBooster Standalone Alignment Station brings inline Alignment Station (iAS) capabilities to other scanners in the fab....

  • Standalone Alignment Station maximizes productivity and yield
    The LithoBooster Standalone Alignment Station brings inline Alignment Station (iAS) capabilities to other scanners in the fab. With LithoBooster, wafer-by-wafer feed forward correction is possible, enabling compensation for processing effects including etching, annealing, CVD/PVD, and more. Whereas traditional process loops rely on feed back control, LithoBooster adds sophisticated feed forward correction capabilities. LithoBooster quickly executes super dense, ultra-precise measurements with superior reliability, and calculates high order and die-by-die grid term as well as shot term corrections. Prior to exposure, the scanner performs wafer global alignment using a sparse EGA sampling plan, and the high order LithoBooster correction terms are fed forward and combined with the scanner’s linear terms to produce the final linear, high order grid, and shot term alignment corrections.

    Delivers industry-leading wafer-by-wafer feed forward corrections for any selected scanner in the fab
    LithoBooster has great flexibility within the process control loop, and can be used with many generations of Nikon systems including S635E through S620D immersion scanners, S322F to S310F ArF scanners, S220D and S210D KrF scanners, and even SF155 steppers; as well as non-Nikon scanners. Depending on individual device manufacturer’s objectives, one LithoBooster system may be shared amongst multiple litho tools for less critical layers, or paired with a litho tool in critical applications, or multiple LithoBoosters could support a single litho tool to enable super-dense sampling for ultra-critical process layers.

    Utilizes absolute grid information to ensure optimal wafer/shot grid modeling
    LithoBooster maximizes productivity through iterative learning and feed back of grid results. Using dense measurements on the product wafer coupled with the absolute grid information from LithoBooster, the optimal grid model is determined. Various alignment modes are possible such as Standard, Plus Edge Dense (increased edge sites), Scrambled, and Plus Intra-shot (increased sites within-shot). This enables adaptability for a variety of types of wafer grid error. In addition, there are a number of correction modes including Linear, High-order Global, Local Area, and Die-by-Die correction methods that compensate for different types of wafer deformation.

    LithoBooster has demonstrated exceptional on-product overlay (OPO) improvement capabilities. A study of wafers having four types of on-product underlayer wafer distortion signatures was evaluated using a traditional, sparse, 16 points/wafer alignment sampling plan, which demonstrated overlay Avg. + 3σ results across lot of x=2.85 and y=2.51 nm. The results were markedly improved to x=1.85 and y=1.63 nm using a dense 626 point LithoBooster sampling plan.

    Minimizes wafer processing effects with mark asymmetry correction and film thickness monitoring function
    Nikon is currently enhancing LithoBooster OPO correction capabilities through the introduction of new functions enabling detection and correction of process-induced target asymmetries, while metrology capabilities are being extended to include high density film thickness monitoring to support predictive/computational focus corrections as well.

    Provides open platform for addition of further overlay, autofocus, and process control solutions
    LithoBooster also provides an open platform for expanded overlay, autofocus, and process control solutions to enhance future capabilities.

    It is real-world, on-product performance that is vital to chipmakers. Nikon combines superior scanner technology with innovative alignment solutions like LithoBooster to deliver exceptional manufacturing performance and productivity—now and for the future.

  • NSR-S322F and NSR-S220D DUV Scanners
    NSR-S322F ArF and S220D KrF scanners deliver world-class performance for critical non-immersion layers. They enable scanner throughput ≥ 230 WPH, as well as SMO ≤ 2 nm for the S322F and ≤ 3 nm for the S220D. They also can be integrated with LithoBooster....

  • Nikon offers the industry-leading S322F ArF and S220D KrF scanners, which utilize the Streamlign platform, to deliver world-class performance for critical non-immersion layers. Chipmakers will use dry lithography as much as possible to balance multiple patterning costs, making scanner throughput vital.  

    The S322F and S220D employ sophisticated dry sequencing, and their wafer stages use optimized scan speed and acceleration capabilities to reduce exposure time. In addition, the Stream Alignment wafer mapping system utilizes multiple alignment microscopes (Five-Eye FIA) and a wide area autofocus sensor (Straight Line Autofocus) to pre-scan the substrate during loading−dramatically reducing wafer overhead time. Together, these innovations enable scanner throughput ≥ 230 WPH. Bird’s Eye Control technology enables single machine overlay accuracy ≤ 2 nm for the S322F and ≤ 3 nm for the S220D, coupled with outstanding overlay stability. These scanners can be integrated with LithoBooster.

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LED/solid state lighting, MEMS, Semiconductor

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