Applied Microengineering Ltd. (AML)
AML unique in-situ Aligned Wafer Bonding Machines & Services
AML manufactures unique, in-situ Aligned Wafer Bonding systems.
The AWB systems offer the versatility to perform in-situ aligned bonding of 2” to 8” wafers using a wide range of techniques including direct, anodic, eutectic, adhesive, thermocompression, solder and glass frit.
AML’s unique in-situ alignment and process capabilities also enable chemical preparation (for example, oxide removal in Cu-Cu bonding) or activation of the bonding surfaces within the bonding chamber, immediately before alignment and wafer contact, without exposure to air between stages.
- In-situ alignment to 1um accuracy, post-bond.
- Confirm alignment immediately before bonding via in-situ optics
- No contact/contamination of bond surfaces with flags
- Large wafer separation – up to 30mm
- In-situ surface preparation
Flexibility for R&D, throughput and automation for volume production.
Applications in MEMS, IC, & III-Vs.
With over 25 years’ experience in bonding and MEMS fabrication, AML offers a complete package – aligner bonding systems with bonding process know-how and in-house support from our BONDCENTRE application lab.
New Exhibitor: No
New Products: No
Displaying Equipment: No
Product Demonstrations: No
Please indicate which industries/technologies your company serves LED/solid state lighting, MEMS, Power Semiconductors, Semiconductor, Sensors