Pickering Interfaces

2900 NW Vine Street
Grants Pass,  OR  97526

United States
  • Booth: 5656

Welcome to SEMICON West!

Pickering PXI & LXI Switching Solutions for Semiconductor Test

High Relay Closure Count for Parallel and I/V Testing

Pickering’s PXI and LXI switching solutions have been used in various levels of semiconductor test including package level and wafer level test, shorts/opens, capacitance, I-V test for transient charge trapping and SPCT (Single Charge Pulse Trapping). Our switching solutions for semiconductor test feature:

  • High fidelity connection –
    • Low path resistance, repeatable connection
  • High relay closure count –
    • Parallel testing for speed 
    • Multiple test point connections to Ground for I-V tests
  • Ability to load test sequences into the unit and utilize triggers to transition tests
  • Carry out capacitive measurements to ensure the internal decoupling capacitors are intact
  • Supported by Switch Path Manager signal routing software
  • Scalability and ease of maintenance thanks to a modular design
  • Multiple Analog Busses allow for parallel testing
  • Choice of PXI or LXI (Ethernet) Communications

Visit our website for more information: www.pickeringtest.com or contact us at ussales@pickeringtest.com.


  • Scalable Reed Relay LXI Matrix Solution
    Designed to test Semiconductors at wafer and package levels, these Reed Relay solutions combine our latest LXI Chassis (model 65-200) with our new 1Amp switching matrix plug-in range—providing access to all signal connections on 200-pin connectors....

  • The plug-ins are constructed using Pickering Electronics’ Reed Relays which offer maximum performance and reliability as well as very fast operate times.

    An important feature of these Matrix platforms is the built-in scan list sequence stores with triggering capability that significantly reduce test times. This feature provides users with the ability to set a series of pre-determined switch sequences in the LXI Matrix, the sequences can then be triggered by software or one of the sixteen DIO software configurable open collector triggers. The Matrices also feature multi-bus capability for parallel testing. 

    The plug-ins comprise four models providing matrices of up to 1,536x4 in increments of 128 (model 65-221), 768x8 in increments of 64 (model 65-223), 384x16 in increments of 32 (model 65-225), and 192x32 in increments of 32 (model 65-227). Users can specify the number of plug-ins (up to six) required and can field upgrade the chassis to extend the matrix if necessary. Another important feature is that over 1,500 relays can be closed simultaneously for specific conditions for parametric testing conditions. 

  • Ultra-High-Density 1A Large PXI Matrix Modules
    These 1A switch matrices have similar switch densities to current 0.25A - 0.5A PXI reed relay high-density matrix solutions, ideal for upgrading lower current modules that experience reliability issues due to their inferior "hot" switching capability....

  • These 1Amp/20W switching modules offer up to 4,096 crosspoints, are available in 2, 4, or 8-slot PXI sizes and are designed for high-performance matrix requirements. 

    Constructed with Pickering Electronics’ new 4mm x 4mm Reed Relays, which have the highest packing density currently available, these BRIC PXI matrices now have twice the density of any competing large matrix module for 1Amp switching in PXI.

    Because of their high level of switching density, these PXI matrices allow a complete Functional ATE system to be housed in a single 3U PXI chassis and allow the use of much lower cost 8 or 14-slot PXI chassis. 

    The matrices are designed with built-in high-performance screened analog busing to minimize the cost and complexity of cable assemblies to the device under test as well as to instrumentation. Dual analog bussing for the narrower matrix options enables completely separate matrices within a single module for parallel testing.

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MEMS, Power Semiconductors, Semiconductor, Sensors

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