The JetStep Lithography system features a large field of view to improve exposure efficiency and throughput. The system is unique in its ability to handle a wide range of substrates and accommodate substrate warp. These and other purpose-designed features, such as on-the-fly auto focus and a large automatic magnification compensation range, provide ways to increase throughput and maximize yield in advanced packaging applications that are unavailable from lithography tools designed for front-end processes or conventional packaging applications. Designed for advanced packaging applications: WLCSP, solder bump, gold bump, Cu pillar bump, RDL/UBM, eWLB/Fan-out, TSV, interposers, non-standard substrates. Available for wafers or panels.