BTU International, Inc.

23 Esquire Rd
North Billerica,  MA  01862-2501

United States
  • Booth: 1366

Visit BTU - see our Pyramax reflow oven

BTU is the global leader in thermal process equipment used for the production of electronics and electronic components. Typically these applications require high productivity and excellent process control. BTU’s convection reflow ovens are used for semiconductor packaging, printed circuit board assembly and LED assembly among other applications.  The Pyramax's superior thermal repeatability and tight atmosphere control make it the reflow oven of choice for the top semiconductor and assembly subcontractors (SATS).   

BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing.  BTU's custom belt furnaces have been made in the USA since 1950.

BTU International, a wholly owned subsidiary of the Amtech Group, has operations in North Billerica, Massachusetts and Shanghai, China with direct sales and service in the U.S.A, Asia and Europe.  Learn more at


  • Pyramax
    BTU’s Pyramax™ family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for SMT solder reflow, semiconductor packaging and LED packaging and assembly....

  • Pyramax™ reflow ovens provide optimized lead-free processing for the ultimate in productivity and efficiency. BTU’s exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry.  With 6, 8, 10 and 12-zone air or nitrogen models, 350oC maximum temperature and a comprehensive menu of options, Pyramax™ reflow ovens are the industry’s most versatile performers and best value.

    The Pyramax is known worldwide as the performance leader. With closed loop convection control the Pyramax reflow oven offers the utmost in process repeatability, board-to-board, oven-to-oven and line-to-line. For semiconductor packaging, BTU offers nitrogen processing using the Pyramax convection reflow oven with astounding atmosphere purity with O2 levels as low as 2ppm above source in the peak zones.  

  • Pyramax TrueFlat
    New reflow oven technology for substrate flatness ...


    • Easy process transfer

    • Low maintenance, no vacuum pump

    • Superior thermal uniformity

    Built on the industry-leading Pyramax platform, TrueFlat is a unique reflow oven configuration to stop substrate warpage. Designed for substrate thicknesses of 0.15 to 0.30mm, TrueFlat technology ends die tilt. The result is consistent and repeatable flatness, and superior thermal uniformity due to the Pyramax’s closed-loop convection heating.

    The new Pyramax with TrueFlat technology does not impact reflow oven footprint, making it easy to transition from existing reflow processes. Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary WINCON™ Windows-based software including factory host/MES interface for Industry 4.0 compliance.

  • Pyramax Vacuum
    Vacuum reflow oven for void reduction....


    • Solder voiding to <5%

    • Thermal uniformity +/-2°C

    • Superior profile control

    • Full MES Integration

    The Pyramax Vacuum reflow oven has been designed with the requirements of large EMS/high-volume automotive customers in mind. The unit is configured with 10 zones of closed-loop convection heating and a maximum production width of 457 x 457mm (18 x 18 inches) inches under vacuum operation. Nitrogen atmosphere capable, the Pyramax Vacuum reflow oven offers a maximum process temperature of 350° C. The unit features integrated controls with BTU’s proprietary Wincon™ windows-based control system and full integration with factory MES/Industry 4.0, including vacuum parameters. Existing Pyramax customers can easily transfer their process to the new Pyramax Vacuum reflow oven.

    • Recipe controlled vacuum parameters
    • Bell jar vacuum chamber design
    • Forced convection and conduction heat assist
    • Low impact thermal transition zone
    • Easy maintenance access
    • Pass-thru mode

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LED/solid state lighting, Other, Plastic/organic/flexible electronics, Semiconductor, Flexible and Printed Electronics-, Sensors
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semiconductor packaging

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