Frontier Semiconductor

165 Topaz St
Milpitas,  CA  95035

United States
  • Booth: 243

We provide a full range of metrology solutions

Since 1988 Frontier Semiconductor (FSM) provides a full range of advanced metrology products for many key semiconductor process steps:

  • Unique optical, non-contact Thickness Measurements of Substrates and Layers in back-grinding and back-etching application.

  • Film Stress and Adhesion measurement equipment for thin film deposition and oxidation, metallization. Unique capabilities include film stress mapping and process characterization at temperatures up to 900 degrees.

  • Metrology for Through Silicon Via (TSV) creation and copper reveal

  • Contact and non-contact Sheet Resistance Measurement for ion implantation, doping, metallization.

  • Die level warp and bow measurement for die stacking.

  • Micro-Raman measurements for stress control in advanced nano device and 3D packaging structures.

  • Film Stress Measurement at room temperature

  • Film Stress Measurement at high temperature up to 900C

  • Adhesion Testing

  • Sheet Resistance Measurement 

  • Thin Film and Thick Layer Thickess and Topology Measurement

  • Roughness Measurement

With a sales and service structure around the world we guaranty optimal support for our global customers.

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