ASNA PRODUCT LINE
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AS568 Standard O-ring and Custom Seals
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Engineering Expertise
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Finite Element Analysis (FEA)
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Failure Analysis (FA)
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High Performance Semiconductor FFKM
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Sealing Solutions for Improved Performance
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Bonded Gate Technology
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SmartSeals PRISM OneKit® and Clamp with QuikVU® windows
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ACE® (ASNA Calculated Engineering)
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ASNA Smart Set®
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BKM® (Best Known Method) Semiconductor Sealing Guide
PRISM oneKit®
PRISM one Kit® and QuikVU® Clamp: Assembled for integrity subfab seal system
PERFREZ® PXC Series
Withstands a broad range of processes with low compression rate semiconductor FFKM o-ring seals
KF & NW Fittings
Assembled for integrity subfab seal system
ASNA Handbook
An ultimate semiconductor sealing techguide for semiconductor and subfab
MX Series™
High temperature perfluoroelastomer (FFKM) o-ring seal solution for harsh environments of semiconductor industry
VAT® Bonded Gates
SMART sealing elements made with PERFREZ® compounds for dynamic, static, & fittings applications
ASNA Brochure
Details include ASNA products, SubFab kit, Case Studies, Bonded Gates, ACE® Engineering, SMART Sealing, guidebook and more
PERFREZ® Series
High performance semiconductor FFKM o-ring seals for plasma, wet and dry, semiconductor applications
XL Series®
ASNA XL Series® semiconductor FFKM o-ring seals are designed for performance excellence.
BKM® Guide for SubFab
An educational Best Known Method guidebook for NW / ISO fittings and clamps in SubFab applications