962 Terra Bella Ave
San Jose,  CA  95125

United States
  • Booth: 130

Welcome to cyberTECHNOLOGIES' home base Semicon West 2014!

cyberTECHNOLOGIES is a leading provider of high resolution and fast true 3D Optical Metrology Systems for non-destructive process control of surface topography, film thickness, roughness and quality inspection as well as Total Thickness Variation (TTV) of Semiconductor Wafers, Via Depth, Probe Cards, Glass Products, MEMS, Solar Cells, Fuel Cells, Printed or Jetted Products, Chip Packages, Medical Devices and many other devices.

Our systems reliably measure on diffuse, absorbent, highly reflective, wet, soft or transparent materials with high vertical and lateral resolution down to sub-nm, even over large areas of interest and with large measurement ranges, from sub-nanometers to several millimeters.

Our In-house software development provides our customers with an easy-to-use system that provides superior automation capabilities, high speed, accuracy, comprehensive data analysis capabilities in R&D and production in industries as varied as medical devices, semiconductors, panel manufacturing, solar, hybrid, MEMS, automotive, pharmaceutical as well as optics manufacturing.


  • CT350T Dual-sided Metrology System
    Dual-sided optical 3D Metrology System for Wafer Thickness and TTV, Warpage, Thickness, Stress and Roughness Measurement. It provides accurate measurements independent of material and surface properties....

  • The CT 350T is a non-contact double-sided optical surface an thickness metrology system with an integrated 300 mm x/y scaning stage. The sensors are mounted on high accurate z-axes and autofocus on any sample. There is a wide range of sensors and sensor technologies avaiable, and multiple sensors, even of different types, can be installed concurrently, making the systems extremely versatile in a wide range of use cases. 

    The software generates 2D profiles and 3D maps simultaneously and makes those available individually or as composites in order to provide a total thickness profile or map, along with TTV across the entire sample.

    Some typical types of samples are:

    • Blank, patterend or bumped wafers: thickness, TTV, warpage, stress, roughness, coplanarity, missing or bridged bumps
    • GaAs or solar wafers: thickness, TTV, warpage, roughness
    • Probe card pins and guide plates: pin height, pin diameter and size, via diameter, pin and via posiiton
    • Fuel cell elements: flatness, layer thickness, alignment
    • Medical devices: flatness, trench depth, gap thickness, coplanarity
    • Special application foils, film and membranes: thickness, roughness, flatness
  • HVM Metrology Cell with dual CT300/350T
    High volume metrology cell with dual metrology systems and common wafer handler for high volume manufacturing...

  • The HVM Metrology Cell with dual CT300 or CT350T units and a common handler provides true metrology capabilities at production speeds. The compact integration of a dual endeffector wafer handler with two high performance metrology systems offers unparalleled metrology throughput per unit of fab floor space. Multiple sensor technologies can be selected to provide superior operational flexibility for the control of a large number of process steps.

    Fully integrated with our automation software, the Metrology Cell can measure wafer thickness, TTV, warpage, stress, bump size, feature/bump position vs nominal, bridging, missing bumps, sub-nm roughness, film thickness down to 10 nm and much more.

    Contact us for a detailed discussion on how this metrology platform can provide more efficiency and comprehensive metrology capabilities for your process control.

  • CT150 Table-Top Lab & Production Platform
    The CT 150 platform offers the same versatility as the larger 300 mm platforms in a smaller table-top form factor....

  • The CT150 system can be configured as a White Light Interferometer with sub-nm resolution for roughness and height measurements, a Confocal Microscope for measuring 3D features down to 1 nm height or a very fast surface topography measurement system to quickly measure an entire 6" wafer or 6"x 6" panel with very high lateral data density, as high as 0.5 µm x 0.5 µm.

    Programs developed during the R&D phase can directly be ported over to a larger production system. Analysis and graphical user interface are identical with all of our other systems, facilitating the transition from development into production. 

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