Trion Technology

2131 Sunnydale Boulevard
Clearwater,  FL  33765

United States
  • Booth: 1365

Plasma Etch and Deposition Systems

Trion Technology designs, manufactures, markets and services versatile plasma equipment (ICP-RIE, PECVD, PVD, Ashers, and more) to enable our customers in the Semiconductor, MEMS, LED, RF Power, F.A., Opto-, III-V, Wafer Level Packaging, Thin Film Head, and Solar industries.

GaN Etch, GaAs Etch, SiO2 Etch, Si02 Deposition, Si3N4 Etch, Si3N4 Deposition, and more.

Our products feature the smallest footprint and lowest cost systems in the industry with proven production reliability. If you wish anything from full-blown production cluster tools to a simple laboratory system, Trion makes it.

Phone: +1 727 461 1888


  • Phantom Reactive Ion Etcher (RIE)
    Designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based chemistries. Compact, modular design built on a space-saving platform....

  • For more information about the Phantom RIE, visit:
  • Apollo Stripping System
    The cost of new stripping systems has escalated to unreasonable levels. Trion has solved this critical problem....

  • The Apollo Stripper is a compact, inexpensive, and versatile system which can be configured for a 200mm or 300mm Chuck. By employing RF bias power, difficult to remove layers of resist can be removed at low temperatures. As required by application, this system can incorporate a microwave source (which is both reliable and free from typical microwave tuning problems) or ICP technology.

    For more information, visit:

  • Oracle Production Cluster System
    The smallest and most flexible full production cluster system on the market....

  • The Oracle consists of a Central Vacuum Transport (CVT), Vacuum Cassette Elevators and up to four Process Reactors. These process reactors are docked to the central loadlock and run in production-mode or can be operated independently. The Oracle can also be configured for either the laboratory environment (with single wafer loading) or for full production (with vacuum cassette elevators).

    Because the Oracle accommodates up to four separate process chambers, there are many possible process combinations, including ash, etch, and deposition modules. Processes are safely run without atmospheric contamination since all chambers are vacuum loadlocked.

    For more information, visit:

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