Resonac America, Inc.

2150 North First Street
Suite 350
San Jose,  CA  95131

United States
https://www.ma.showadenko.com/

• Booth: V12

Showa Denko Materials is contributing to the evolution of information and communication equipment through advanced technology development in materials for semiconductors, display-related materials, and printed wiring board materials.

 Press Releases

• Showa Denko Materials Establishes the “JOINT2” Consortium for the Development of Next-Generation Semiconductor Packaging Technologies (20211124)
  Showa Denko Materials Co., Ltd. (President and CEO: Hisashi Maruyama) announces the establishment of the “JOINT2 (Jisso Open Innovation Network of Tops 2)” consortium comprised of 12 companies developing semiconductor packaging materials, substrates, and equipment (see “Members” in the “Overview of the JOINT2 Consortium” below). The consortium, based at Showa Denko Materials’ Packaging Solution Center in Kawasaki City, Kanagawa Prefecture, launched operations on October 1, and its member companies will jointly develop packaging evaluation technologies, materials, substrates, and equipment in response to technological changes, with the aim of establishing next-generation semiconductor packaging technologies, including 2.5D*1 and 3D*2 packaging, and evaluation technologies.
  
  As the commercialization of 5th generation mobile communications systems (hereinafter “5G”) progresses, the enhanced version of 5G (hereinafter “post-5G”) with ultra-low latency*3 and multiple concurrent connections*4 is expected to be applied in various fields, including autonomous driving and telemedicine. For the current systems, IC chips with different functions, such as logic and memory, are mounted separately on substrates, but to support 5G and post-5G systems, these IC chips and other components require high-density mounting to prevent further signal delays, so the demand is growing for technologies that can integrate different chips into a single semiconductor package.
  
  To meet these challenges, Showa Denko Materials and other companies jointly established the “JOINT2” consortium in October this year to develop next-generation semiconductor packaging technologies, including 2.5D and 3D packaging, required for 5G and post-5G information communications systems. JOINT2 will form multiple working groups among its members, bringing their expertise through open innovation to develop next-generation semiconductor packaging technologies, such as fine-pitch bump bonding,*5 fine-pitch RDL (Redistribution layer) formation*6 used for filling the gap of connection pitch between devices and substrates, and highly reliable large substrates designed to enlarge mounted components.
  
  Ahead of establishing the JOINT2 consortium, Showa Denko Materials was selected by the New Energy and Industrial Technology Development Organization (hereinafter “NEDO”) in May this year for its project “Post-5G Information and Communication Systems Infrastructure Reinforcement Research and Development Project/Development of Advanced Semiconductor Manufacturing Technology.” With subsidies from NEDO, JOINT2 membership fees, and Showa Denko Materials’ investment, the consortium will introduce the equipment necessary to evaluate next-generation semiconductor packages, including flip chip bonders and equipment for panel CMP, temporary bonding and de-bonding, panel grinding, plating, and wafer molding.
  
  In 2018, Showa Denko Materials relocated its Open Laboratory in Tsukuba City, Ibaraki Prefecture, to Kawasaki City, Kanagawa Prefecture, with the facility renamed the Packaging Solution Center as a research and development base for semiconductor packaging materials and processes.
  In the same year, Showa Denko Materials established the “JOINT (Jisso Open Innovation Network of Tops)” consortium at the Packaging Solution Center to provide comprehensive solutions for semiconductor packaging materials, equipment, and processes by promoting open innovation in collaboration with other companies. The JOINT projects include the development of large fan-out panel level packaging*7 for application processors as well as passive components in a system-in-package for stacking multiple chips inside a single package. The combination of the member companies’ materials and equipment will allow materials and equipment to be evaluated under conditions similar to the semiconductor evaluation tests conducted by customers. This arrangement will help customers save the time and trouble of carrying out individual evaluations for their suppliers and thereby respond to the need for speedy development of semiconductor packages.
  
  For JOINT2, Showa Denko Materials will work with its member companies to further promote open innovation and accelerate the development of more sophisticated evaluation technologies, materials, substrates, and equipment applicable to next-generation semiconductor packaging technologies.
  
  
  *1 2.5D packaging refers to the technology of arranging parallel IC chips on a silicon interposer.
  *2 3D packaging refers to the technology of stacking chips using a through-silicon via (TSV).
  *3 Ultra-low latency refers to minimal delay during communication.
  *4 Multiple concurrent connections refer to connecting multiple devices simultaneously to one base station.
  *5 Fine-pitch bump bonding refers to the technology of vertically connecting IC chips and other components with high-density metal protrusions.
  *6 Fine-pitch RDL formation refers to the technology of connecting IC chips and other components in a planar direction with high-density circuit.
  *7 Fan-out panel level packaging refers to one of the packaging technologies with semiconductors packaged at the panel level, unlike fan-out wafer level packaging with semiconductors packaged at the wafer level. The use of panels larger than wafers allows numerous chips to be mounted at a time, leading to higher productivity and lower packaging costs.

• Showa Denko Materials to Launch the Mass Production of “MCL-E-795G,” an Advanced Functional Laminate Material for Printed Wiring Boards with High Packaging Reliability (20211124)

  Showa Denko Materials Co., Ltd. (President and CEO: Hisashi Maruyama; hereinafter “Showa Denko Materials”) announces the mass production of the “MCL-E-795G” series, an advanced functional laminate material for printed wiring boards, starting in October 2021. MCL-E-795G achieves high packaging reliability such as low warpage and high heat resistance required for semiconductor package substrates used for large servers in data centers and high-performance computing (HPC).*1
  
  With remote work becoming more common amid the novel coronavirus pandemic and 5th generation mobile communications systems (5G) spreading in recent years, the demand is growing for large servers in data centers and other devices with numerous high density semiconductor packages to process enormous amounts of data at high speeds. Achieving higher density requires enhanced packaging reliability of printed wiring boards for semiconductor packages as well as reduced substrate warpage caused by the thermal expansion difference between semiconductor chips and substrate materials in packaging process. High heat resistance is also essential for substrate materials now that the lead-free packaging process has become mainstream to address environmental concerns, such as complying with the Restriction of Hazardous Substances (RoHS) Directive,*2 leading to more customers soldering at high reflow*3 temperatures in their manufacturing processes. In addition, high levels of safety and reliability have become increasingly important requirements for semiconductor package substrates as they are used in electronic devices advancing in wide-ranging fields and expected to be used under various conditions.
  
  To overcome these challenges, Showa Denko Materials has realized superior low warpage properties by, for example, applying low CTE (coefficient of thermal expansion) resins and increasing the filler content,*4 resulting in a 15 to 20 percent warpage reduction*5 from its conventional models when packaging the “MCL-E-795G” series. In particular, the type LH combining low CTE glass cloth can reduce warpage by additional 20 percent.*6 The MCL-E-795G series has also achieved high heat resistance and excellent insulation reliability by designing and incorporating resins highly resistant to thermal shock and external stress as the framework, thereby helping customers improve process yields in their manufacturing processes. Moreover, the series features flame-retardant resins to provide customers with safer semiconductor package substrates, and obtained V-0/VTM-0 certification under UL-94,*7 a standard indicating the flammability ratings for plastic materials.
  
  The strength of Showa Denko Materials’ laminate materials for printed wiring boards lies in their excellent packaging reliability, including warpage properties and flatness, with their semiconductor package substrate applications holding the world’s top share in value terms*8 (FY2020).
  
  Showa Denko Materials’ Packaging Solution Center also boasts superior simulation and packaging substrate evaluation technologies to facilitate the development of semiconductor package substrates with the industry’s top-class packaging reliability by offering optimal products to customers based on their applications.
  
  Showa Denko Materials will continue to take full advantage of its Packaging Solution Center and other facilities to develop innovative, more technologically advanced laminate materials for printed wiring boards and further expand their market share, while contributing to the creation of more sophisticated printed wiring boards.
   

  *1 High-performance computing refers to the use of a high-performance computer system to process enormous amounts of data and perform complex calculations at high speeds.
  *2 The EU’s Restriction of Hazardous Substances Directive restricts the use of certain hazardous substances in electric and electronic equipment.
  *3 Reflow refers to a method of mounting semiconductor packages by melting solder attached to printed wiring boards.
  *4 Increasing the amount of filler contained in resin.
  *5 Compared with Showa Denko Materials’ MCL-E-705G.
  *6 Compared with Showa Denko Materials’ MCL-E-795G.
  *7 UL (Underwriters Laboratories Inc.) is a testing organization in the United States that certifies the safety of industrial products and issues UL certifications as proof of product safety. UL-94 V-0/VTM-0 certification is granted when meeting the UL standards for the height of a vertically flaming specimen and the time to extinguish the flame after ignition.
  *8 Source: Prismark Partners (June 2021)
  
   

  < MCL-E-795G >
  ■ Overview
  MCL-E-795G is an advanced functional laminate material for semiconductor package substrates used in such fields as large servers in data centers and high-performance computing (HPC).
  
  ■ Features
  (1) Superior low warpage properties required for large FC-BGA (flip chip ball grid array) package substrates.
  (2) High heat resistance and excellent insulation reliability that help customers improve process yields in their manufacturing.
  (3) High level of safety with UL94 V-0/VTM-0 certification.

• Showa Denko Materials’ Anode Materials for Lithium-ion Batteries Adopted for Toyota’s New “Aqua” (20211124)

  Showa Denko Materials Co., Ltd. (President and CEO: Hisashi Maruyama) is pleased to announce that its anode materials for lithium-ion batteries (hereinafter “anode materials”) have been adopted as a component of the lithium-ion batteries installed in some model grades of the new hybrid vehicle “Aqua,” launched in July 2021 by Toyota Motor Corporation (President and Representative Director: Akio Toyoda; hereinafter “Toyota”), following the adoption for the hybrid model of the Toyota “Yaris.”
  Showa Denko Materials also announces the establishment of a solid patent portfolio for anode materials technologies, including those adopted for vehicles, with multiple technologies patented for particle shapes, sizes, and other properties.

  Toyota’s all-new “Aqua” is a hybrid vehicle designed to contribute to carbon neutrality, and has been well-received for its excellent fuel efficiency.
  Lithium-ion batteries used for electrified vehicles such as hybrid and electric vehicles require a large-current charging/discharging capacity to improve fuel efficiency. To help these batteries for electrified vehicles efficiently charge/discharge at a large-current, Showa Denko Materials has optimized the particle shapes, sizes, and other properties of anode materials through such acquired technologies as particle design and surface structure control to reduce electrical resistance. Based on its highly evaluated performance, Showa Denko Materials’ product was selected for the Toyota vehicle.

  Showa Denko Materials has been applying for patents on anode materials technologies in Japan and overseas since 2008 in order to build a multifaceted patent portfolio for anode materials ranging from structures to physical properties and applications. In 2021, Showa Denko Materials was granted patents on multiple technologies for anode materials with various particle shapes and sizes, including those for the adopted product, through the super accelerated examination* conducted by the Japan Patent Office, thereby successfully establishing a solid patent portfolio.
  Showa Denko Materials will actively execute its patent rights to protect its research and development outcomes as well as its products, while further strengthening its patent portfolio to differentiate its own technologies and to maintain and enhance its market superiority.

  Showa Denko Materials will continue to provide environmentally friendly products that can contribute to the development of a carbon-neutral, sustainable society.

   *Super accelerated examination refers to the system that enables a far quicker examination of important applications meeting certain requirements than the ordinary accelerated examination. While the average period from the examination request to the first examination result is 10.2 months under the regular examination (in 2020) and 2.7 months under the accelerated examination (in 2020), the super accelerated examination is conducted within one month from the examination request (within two months, in principle, for applications transferred to the national phase after international applications). (Source: Japan Patent Office Annual Report 2021)

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