Towa USA Corporation

1430 Tully Road
Suite 416
San Jose,  CA  95122

United States
  • Booth: 1952

Welcome to TOWA eBooth, please connect with us!

TOWA is a leading company in the semiconductor molding equipment market. We offer equipment using our high quality / flow free compression molding method and our proven transfer molding method. We also manufacture ultra-precision molds that have been highly acclaimed by customers. Together with our molding equipment, our singulation system was developed from both aspects of the dicer and product handler to provide the optimal method of singulation for each product type. The result is high quality cutting whilst improving customers' productivity with high throughput.

Located in the heart of the Silicon Valley, our TOWA USA's San Jose Package Development Center was established to support customers’ development programs. Our activities are centered around Compression and Transfer Molding for Advanced Packaging and we collaborate with a broad spectrum of industry members from IDMs, OSATs, Fabless Companies, Government Contractors, Technical Institutes and Consortiums. Please contact us for more information.


  • CPM1180
    Fully Automated Large Panel Compression Molding System....

    • The first fully automated large panel compression molding system on the market.
    • The ultimate cost accomplished by molding ultra-large panels.
    • Capable of resin molding 660mm X 620mm panels and 18-inch (Φ450mm) wafers.
    • Environmentally friendly equipment that generates no waste.
  • YPM1180
    Transfer Molding Equipment Compatible with Large Workpieces....

    • Compatible with large, 100mm X 300mm substrates.
    • Central pressure system (with a hold frame structure).
    • Compatible with side gate and top gate.
    • Compatible with release films.
    • Unique, compact, high-precision press mechanism.
    • Capable of molding large LF with clamping capability of 180tons.
    • Significantly reduced footprint despite its compatibility with large workpieces.
  • FMS3040
    Fully Automatic Dicing / Singulation Equipment with Dual Spindle....

    • Full automatic equipment capable of handling frames up to 100mm X 300mm.
    • Enhance variations of offload product processing methods.
    • Enable to cut small package (minimum 1.0mm X 1.0mm).
    • Twin table, twin dicer specification.
    • Enable 40,000 UPH at high speed conveyance.
    • Capable of dicing molded products after correcting large warpage.
    • Capable of correcting product offset and optimize cut accuracy.

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