EBINAX Co., Ltd.

5-22-13 Higashikojiya, Ota-ku
Tokyo,  144-0033

  • Booth: V15

Our company name is Ebinax in Japan. Our mission is to pursue new surface treatment possibilities to contribute to the future of manufacturing. Our plating technology is used to improve the performance of electronic equipment parts. Ebinax can solve customers' problems, with our abundant plating knowledges and certain techniques and latest analysis equipment.


  • Glass Through-hole Processing
    High quality and precise glass through-hole...

  • 1. Free of microcracks, chipping, induced stress or etc.

    2. Smooth inside walls of micro holes

    3. Ultra-dense micro holes

    4. Miniaturization and integration of devices

  • Metal Plating on Glass Substrates
    Glass Substrates for High-frequency Circuit Boards...

  • 1. Improved hermeticity by high-level filling and void-less

    2. Uniform Cu plating around the inner wall with various hole shapes

    3. We can make consistent proposals from fine hole processing to Cu plating.

  • "Sugo-Hie" Micro Heat Fin
    "Sugo-Hie" is very unique surface technology."Sugo-Hie" has very high heat transfer capacity....

  • 1. Approximately 90,000 to 200,000 Micro-Fins/㎠ - Instantly increase surface area 2-3 times by electrodeposition method

    2. Projection shape with a height of 5μm or less - Can be processed into any shape and various materials

    3. Establish high productivity - Achieves low cost and mass production with a unique construction method

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