Mi Equipment (M) Sdn. Bhd.

No 20, Medan Bayan Lepas Technoplex,
MK12 Taman Perindustrian Bayan Lepas
Penang,  11900

  • Booth: V36

Mi Equipment welcomes all to experience our latest product.

Mi Equipment is a leading technology player in the semiconductor industry since 2007 and is part of Mi-Technovation Group. We have strong global presence with World Class R&D and Manufacturing Facilities in Malaysia, China, Taiwan, Korea and USA. With our highly passionate engineering, sales and technical teams, we provide leading edge technologies covering from Wafer Fab Backend, Assembly, Final testing and inspection.

We offer advanced WLCSP Die Sorter with fully integrated inspection/ test & marking capabilities, Wafer Reconstruction solution (FOWLP), Final Test Handlers, IR vision Inspection, Laser-assisted Bonding and Smart Factory Automation Innovations. 

Mi Equipment has been a key partner to the world’s major semiconductor IDMs and OSATs with close to 1000 machines installed worldwide.


  • Vision Inspection Equipment
    Vi Series - IR & Vision Inspection...

  • Vi Series:

    Vision inspection machine for wafer and package inspection with IR capabilities

  • Wafer/ Package Final Test Equipment
    Si Series - Die & Package Test Handler...

  • Si Series:

    Final test handler for Wafer Level, Package Level and Wafer Known-Good-Die Testing (KGD)

  • Assembly & Packaging Equipment
    Mi Series - Advanced Die Sorter & Wafer Reconstruct Ai Series - Laser-Assisted Die Bonding...

  • Mi Series:

    Die sorting and wafer reconstruction machines for advanced wafer level packaging, such as WLCSP, FOWLP and CSPs

    Ai Series:

    Precision bonding machine (LAB/LCB) for extra fine pitch with thin die and substrate for large die & 2.5D packaging

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