Besi (BE Semiconductor Industries N.V.)

33 East Comstock Drive
Suite 4
Chandler,  AZ  85225

United States
  • Booth: 431

Besi invites you to our booth #6162 - Semicon West 2018.

Continuing our tradition as a leading advanced packaging semiconductor manufacturing solutions provider, we take great pride in sharing our latest technology for

  • Thermal Compression Bonding (TCB)
  • Die Attach
  • Multi Chip and Component Die Attach
  • Flip Chip
  • Molding
  • Saw Singulation
  • Trim & Form
  • Plating Equipment. 

We look forward to seeing you and allowing us to show you how BESI’s solutions in advanced packaging can meet your manufacturing needs.  

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