ASM Pacific Technology (Americas)

7850 S Hardy Dr
Suite 110
Tempe,  AZ  85284

United States
  • Booth: 839

Welcome to ASM Pacific, your assembly solutions partner

ASMPT manufactures equipment for the assembly of IC, COB, COG, CIS, OPTO, Power & LED products

Equipment includes: 

- Die bonders for Epoxy, Eutectic, Solder, FlipChip, Silver Sintering & TCB Processes

- Lens Holder bonder & AutoFocus system for CIS assembly

- LED Laser Dicers, Die sorters, Die and Wire Bonders

- Wire bonders for Aluminum/Gold Wedge

- Wire bonders for AU/CU/AG Ball bonding and AU/CU Stud bumping

- Encapsulation systems for ICs w/ strip, Reel-Reel, wafer level processing

- Trim/Form/Singulation systems for leadframes

- Test Handlers for IC singulated units (turret handling)

- Epoxy Cure & solder reflow ovens (as a part of ASM Integrated Assembly Lines

- Laser Dicing systems

- LowK Wafer Grooving

- ECD & PVD Systems for Advance Packaging

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