Heidelberg Instruments, Inc.

2539 W 23th St Suite A
Torrance,  CA  90505

United States
https://heidelberg-instruments.com/
  • Booth: 1661


Heidelberg Instruments - The power of direct writing

Heidelberg Instruments is a world leader in the development and production of high-precision photolithography systems, maskless aligners and nanofabrication tools. The systems range from small and easy to use tabletop systems to highly complex photomask production equipment with exposure areas of several square meters. Heidelberg Instruments systems are installed in academic and industrial sites in more than 50 countries and are used in research, development and production. With over 35 years of experience and more than 1,000 systems installed worldwide, we can provide lithography solutions specifically tailored to meet all our customers micro- and nanofabrication requirements for the production of 2D and complex 2.5 and 3D structures – no matter how challenging. Applications include MEMS, BioMEMS, nanotechnology, ASICS, TFT, micro-optics and others. 


 Products

  • Maskless Aligner MLA300 for Volume Production
    Optimized for industrial manufacturing, with high throughput and seamless production line integration for the fabrication of sensors and sensor ICs, MEMS and microfluidic devices, analog and digital ICs, ASICs, advanced packaging, and other applications....

  • Product Highlights MLA300 Maskless Aligner

    Direct-write Lithography

    No mask-related costs, effort, or security risks

    Flexibility

    Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serialization

    Time-saving

    Shorter time from prototyping to production. Digital design management replaces conventional mask library

    Exposure Quality

    Optical compensation of scaling, rotation; patented substrate tracking technology

    Dynamic Autofocus

    Superior critical dimensions (CD) uniformity on warped or corrugated substrates

    Exposure Speed

    300 x 300 mm in 19 minutes

    Full Facility Integration

    Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES)

    Low Cost of Ownership

    Laser lifetime 10 years at 24/7 operation. Power consumption Eur 11,667 per year at 0.2 Eur/ kWh. Filters and replacement parts 5,400 Euro/yearProduct Highlights

    Direct-write Lithography

    No mask-related costs, effort, or security risks

    Flexibility

    Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serialization

    Time-saving

    Shorter time from prototyping to production. Digital design management replaces conventional mask library

    Exposure Quality

    Optical compensation of scaling, rotation; patented substrate tracking technology

    Dynamic Autofocus

    Superior critical dimensions (CD) uniformity on warped or corrugated substrates

    Exposure Speed

    300 x 300 mm in 19 minutes

    Full Facility Integration

    Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES)

    Low Cost of Ownership

    Laser lifetime 10 years at 24/7 operation. Power consumption Eur 11,667 per year at 0.2 Eur/ kWh. Filters and replacement parts 5,400 Euro/year

  • MLA150 for R&D, Rapid Prototyping & Small Volumes
    Maskless tool for R&D, rapid prototyping and small production volumes, designed for binary lithography. Application areas include nanofabrication of quantum devices (2D, semiconductor materials, nanowires) MEMS, micro-optics, sensors, MOEMS, and others....

  • Product Highlights MLA150

    Perfect for Multiuser Facilities

    Training <1 h to fully qualify as a user

    Fast and Accurate Alignment

    250 nm front alignment, backside alignment, alignment error compensation

    Flexible

    2 lasers can be installed simultaneously on the same system to expose the whole range of photoresists

    Low Operation Costs and Easy Maintenance

    10-20 years of laser lifetime

    Direct-write Lithography

    No mask-related costs, effort, or security risks

    Grayscale Mode

    For simple 2.5D structures

    Exposure Quality

    Edge roughness 60 nm; CD uniformity 100 nm; 40 nm address grid; autofocus compensation for warped/corrugated substrates

    User-friendly

    Specifically designed software and workflow make the tool operation fast and easy

    Exposure Speed

    150 mm wafer in <16 min with 405 nm laser

  • ULTRA – Fabrication of semiconductor components
    Designed to produce non-critical semiconductor photomasks for design nodes down to 130 nm, and non-Manhattan designs, for the fabrication of semiconductor components for electronics and automotive industries, including microcontrollers, LED, IoT, MEMS, …...

  • Two Models

    ULTRA 1 for 180 nm design node; ULTRA 2 for 130 nm design node

    High Exposure Quality

    Line edge roughness 20 nm; CD uniformity 30 nm; positioning accuracy 40 nm; real-time optical autofocus; custom high numerical aperture (NA) write-lens optimized for laser exposure

    High Precision

    XY stage fully designed and manufactured by Heidelberg Instruments; full air bearing stage; zero thermal expansion zerodur™ chuck; differential interferometer for position measurement

    Precise Second Layer Alignment

    Sophisticated correction matrix based on a 2D measurement of the first layer. Compensation of arbitrary local position distortions; 100 nm accuracy

    High Throughput

    High-speed SLM with high data rate for fast exposure. 150 mm wafer in < 45 minutes

    Writing Stability

    Closed-loop environmental chamber complies with stringent requirements for semiconductor photomask production; integrated metrology system with flowbox and software corrections compensates for any variations in environmental parameters

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