Fraunhofer IZM is a worldwide leading institute for microelectronic packaging. Fraunhofer IZM-ASSID provides prototyping and low-volume manufacturing services (300/200 mm) at its leading-edge pilot line for wafer-level packaging. Fraunhofer IZM-ASSID has established strong cooperations with leading material and equipment suppliers in which customer-specific solutions in the field of material, equipment and processes are developed and introduced into products. As a member of the Fraunhofer Cluster 3D Integration, Fraunhofer IZM-ASSID offers fully customized support for 3D integration and 3D SiP including design, technology and reliability.
Core Competencies:
- Leading-edge wafer level packaging
- 3D heterogeneous system integration
- Wafer-level System-in-Packages (WL-SiP)
- Enhanced interconnection & assembly technologies
- Customized technology development
- Customer-specific prototyping & pilot-line manufacturing
- Process, equipment & material evaluations as well as qualification
- Process transfer & product integration