Gel-Pak

31398 Huntwood Ave
Hayward,  CA  94544-7818

United States
http://www.gelpak.com
  • Booth: 643


Visit Gel-Pak at Booth 6061

Gel-Pak manufactures a line of proprietary Gel and elastomer coated device carriers and handling materials that offer solutions for applications where damage during handling must be avoided.  The company''s uniqe elastomer technology serves as the basis of its Gel-Box™, Gel-Tray®, Gel-Film® and patented Vacuum Release (VR) products.  These products effectively immoblize devices during shipping and handling. 

For more than 40 years, Gel-Pak has partnered with semiconductor and optoelectronic  customers to create handling solutions that protect sensitive components during manufacturing and shipping.  The company is trusted by some of the world''s largest manufactures to create customized carriers that secure and immobilize their devices. 


 Press Releases

  • Contact: Jennifer Dossee Nunes

    Phone: 510-576-2253

    FOR IMMEDIATE RELEASE

    9 A.M. PST 10/26/2021

    GEL-PAK SHOWCASES NEW PRODUCT PLATFORMS AT

    SEMICON WEST 2022

    HAYWARD, CA OCTOBER 26, 2021:  Gel-Pak, a division of Delphon and worldwide leader in protective carriers for semiconductor, optoelectronic, and medical devices, will showcase its new Polyurethane Device Carrier, Texturized Film Device Carrier and LCS2 Lid/Clip system at Semicon West in San Francisco December 7-9, 2022.

    Gel-Pak’s new Polyurethane Device Carriers look and function similar to the market-leading Gel-Box, Gel-Tray, and Vacuum Release Tray products, but with an alternative elastomer technology.  The proprietary polyurethane material is both static dissipative and non-silicone.

    The Textured Film Carrier products, based on a reversible adhesion technology known as the Gecko effect, uses microstructures to securely hold components in place during shipping and handling.  The film is ideal for in-process device handling and for shipping of packaged components.  The product is available in sheet and roll format or it can be laminated to a JEDEC standard or customer-supplied carrier.

    The new LCS2 Lid/Clip Super System, Developed in partnership BAE Systems, prevents thin semiconductor die from migrating out of the pockets of waffle pack/chip trays during shipping and handling.

    About Gel-Pak

    Founded in 1980, Gel-Pak has developed a line of proprietary elastomer based device carriers and handling materials that offer solutions for applications where damage during handling must be avoided. The company's unique elastomer technology serves as the basis of its Gel-Box™, Gel-Tray®, Gel-Slide®, E-Film™ and  patented Vacuum Release™ products. These products effectively immobilize devices during shipping and handling. For further information on Gel-Pak's product line, please refer to the website at www.gelpak.com.

    About Delphon

    Delphon is the materials incubator and advanced manufacturing center known for solving unique product development and manufacturing challenges. By combining unique materials and proprietary technologies in its state-of-the-art clean-room lab, Delphon partners with customers to move ideas quickly into novel products. Its well-known brands Gel-Pak, UltraTape and TouchMark are innovators of solutions for diverse markets including semiconductors, data storage, advanced medical devices, optical, photonics, aerospace, defense,

    For more information, please contact Jennifer Nunes, Sr. Director of Marketing, at [email protected] or visit www.delphon.com.

  • Company Contact: Jennifer Dossee Nunes

    Phone: 510-576-2253

    FOR IMMEDIATE RELEASE

    9 A.M. PST 10/26/2021

    GEL-PAK Wins East Bay Innovation Award FOR LCS2
    Semiconductor Shipping Protection Technology

    HAYWARD, Calif. – October 26, 2021:  Gel-Pak, a division of Delphon and worldwide leader in protective carriers for semiconductor, optoelectronic, and medical devices, was honored earlier this month with an East Bay Innovation Award for its new Lid/Clip Super System LCS2TM.  More than 200 nominees from across Northern California’s Alameda and Contra Costa Counties were highlighted at an awards ceremony held October 14, 2021, during which the winners were announced.

    Developed in partnership with global military electronics manufacturer BAE Systems, Gel-Pak’s LCS2 product protects thin semiconductor and compound semiconductor chips by preventing them from migrating out of the pockets of waffle pack chip trays during shipping and handling.

    “More than ever before, given the ongoing chip shortage, every chip counts, so protecting these delicate devices during transport is crucial,” said Joseph Montano, president of Delphon. “Our novel LCS2 system is invaluable to chipmakers, as it helps prevent them from losing millions of dollars in damage and yield loss, as well as the costs they would incur for rework or remanufacturing.”

    Home to such companies as Tesla and Lawrence Livermore Lab, the East Bay (named for its location east of San Francisco) has a track record of innovation. The East Bay Economic Development Department launched the awards program in 2013 to showcase outstanding organizations in the region that embrace innovation in their manufacturing, products, services, design, and information.

    This year’s list of nominees was reviewed by subject matter experts and narrowed down to 20 finalists in 10 competitive categories, including Engineering and Design – the category for which the LCS2 product was chosen the winner.

    About Gel-Pak

    Founded in 1980, Gel-Pak has developed a line of proprietary elastomer-based device carriers and handling materials that offer solutions for applications where damage during handling must be avoided. The company's unique elastomer technology serves as the basis of its Gel-Box™, Gel-Tray®, Gel-Slide®, E-Film™ and  patented Vacuum Release™ products. These products effectively immobilize devices during shipping and handling. For further information on Gel-Pak's product line, please refer to the website at www.gelpak.com.

    About Delphon

    Delphon is the materials incubator and advanced manufacturing center known for solving unique product development and manufacturing challenges. By combining unique materials and proprietary technologies in its state-of-the-art clean-room facilities, Delphon partners with customers to move ideas into novel products. Its well-known brands Gel-Pak, UltraTape and TouchMark are innovators of solutions for diverse markets including semiconductors, data storage, advanced medical devices, optical, photonics, aerospace, and defense. For more information, visit www.delphon.com.

    Media Contacts:

    Jennifer Nunes, Sr. Director of Marketing, Delphon, [email protected]

     


 Products

  • Gel-Pak LCS2™ Lid/Clip Super System
    LCS2 prevents thin semiconductor components from migrating out of the pockets of waffle pack chip trays during shipping and handling....

  • Problem/Application: 
    Many of today’s leading semiconductor manufacturers experience issues with thin compound semi die (<250m) migrating out of the pockets of waffle pack trays during shipping. BAE Systems, a large international defense electronics company, has documented the high cost of RMAs, yield loss and rework labor associated with this die migration issue.  Based on Delphon’s fundamental capabilities in solving complex materials and manufacturing problems, BAE Systems selected Delphon’s Gel-Pak division as a partner to identify the root causes of this costly Component-Out- Of-Pocket (COOP) condition.

    The study revealed that die migration is attributed to deficiencies in the existing waffle pack tray/lid technology, which results in gaps between the tray and lid, such as:

    • Warpage common to injection molded chip trays and lids.
    • Misalignment and/or pinching of non-woven polyethylene inserts (such as Tyvek paper) when preparing waffle pack for shipment.
    • Uneven stresses, caused by the industry standard one-piece clip, which deforms the chip tray and lid.

    Challenges/Requirements

    • Uniformly seal each individual tray pocket.
    • Compensate for waffle pack tray and lid flatness issues.
    • Be compatible with existing pick & place equipment infrastructure.
    • Only use static dissipative, low outgassing, non-silicone, FOD-free materials that are prevalent in the semiconductor industry.
    • Develop a methodology to validate that the solution eliminates COOP.



    Gel-Pak Solution

    • Working with BAE systems, Gel-Pak engineered a patent pending Lid Clip Super System (LCS2TM) compatible with standard waffle pack trays. LCS2 was designed to ensure effective sealing of every pocket in order to establish a COOP-free carrier solution. 
    • LCS2 was developed using a low outgassing, static dissipative, low density polyurethane foam and industry approved interleaf material assembled into a static dissipative injection molded lid using silicone free pressure sensitive adhesive. The patented “gold” lid was combined with a patented, highly engineered “gold” clip design that uniformly compresses the lid onto the tray, ensuring complete contact of the entire interleaf against the waffle pack tray surface.
    • Static dissipative material for the lid and clip was selected and tested per ANSI/ESD S11.11 to provide ESD Class 000 protection for high value devices with the lowest voltage susceptibility thresholds. 
    • To measure LCS2 lid/clip system performance, a new test method was developed using an x-ray system specifically designed to detect COOP on incoming waffle packs prior to lid removal.

    Outcome

    • LCS2 performance was validated by rigorous 34” drop testing of 50m GaN die loaded in industry standard waffle trays. X-ray imaging confirmed the absence of COOP conditions when using the LCS2. In comparison, when performing same drop tests using industry standard waffle pack solution, COOP was readily observed.

  • Gel-Pak Textured Vertec Film/Carrier
    Textured Film Film/Carrier products hold components in place using a unique micro-texture. The film is ideal for in-process handling and shipping of packaged components. ...

  • Case Study:

    Problem/Application

    Semiconductor companies and industrial manufacturers alike need a universal carrier to safely to handle delicate devices of varying sizes within factories and hold components with precision alignment. Both a large OSAT company (Silicon Photonics Chip) and an industrial automation company (QFN Packages) reached out to Delphon’s Gel-Pak division to design universal carrier platforms for multiple sized components.  This carrier solution protects the devices from damage and avoids the high costs of custom carriers for each device size. 


    Challenges/Requirements

    • Holds 800ųm or larger device sizes on same carrier
    • Provide sufficient holding force while also enabling easy removal
    • Compatible with automated die handling equipment
    • Make available in low, medium and high tack versions to handle wide variety of device types
    • Format in JEDEC standard trays (2” 4”, Matrix Tray) or on customer specific substrates

    Gel-Pak Solution

    • Leveraging Delphon’s expertise in solving complex product development and manufacturing challenges, Gel-Pak worked closely with the customers to define their unique requirements. The R&D team researched TPE chemistries to develop a Gel-Pak bio-inspired texturized film with properties that mimic the adhesive forces of biometric structures found in nature.
    • The TPE material was optimized to minimize transference and outgassing.
    • The texturized film “dimple” geometry and tack levels were optimized to securely hold devices while allowing for easy of unload 
    • The final film construction consisted of the textured film bonded to a base PET substrate along with a coversheet. A pressure sensitive adhesive (PSA) was laminated to backside of PET substrate in order to mount the film to a standard JEDEC format tray or a customer-specified carrier.


    Outcome

    • Working closely with its customers, Gel-Pak improved the efficiency of in-process handling of the OSAT’s Si photonic chips and the industrial automation company’s QFN packages. The textured film securely holds devices of different sizes on a single carrier, which eliminates the need for custom molded carriers. 
    • The texturized film carrier saves time and eliminates the costs associated with molding a custom carrier or purchasing individual carriers for each unique device size.

  • Gel-Pak Polyurethane Device Carriers
    Non-silicone Device Carriers look and function similar to the standard Gel-Box, Gel-Tray, and Vacuum Release Tray products, but with an alternative static dissipative elastomer technology....

  • Gel-Pak's Vacuum Release, Gel-Box, Gel-Tray, and Gel-Film product lines are now available with a new non-silicone elastomer technology.

    VRP Series

    Gel-Pak’s new VRP product line consists of a non-silicone polyurethane film membrane over a mesh material that holds components in place until they are released “on-demand”by applying vacuum to the underside of the tray. The new polyurethane Vertec® vacuum release tray provides the same appearance and functionality as the traditional Gel VR Tray, yet is both silicone-free and static dissipative.

    • Designed to handle components from 250 μm to 300 mm
    • Immobilizes and protects valuable devices during shipping and handling
    • Ideal for high-volume automated device pick and place applications
    • Available in 2” & 4” trays, large format, and custom plate sizes

    APV Series

    Gel-Pak's APV product is a new silicone-free pocketless device carriers that looks and functions the same as the standard Gel-Box AD series products, but with an alternative static dissipative elastomer instead of traditional Gel.

    • Securely holds devices in place during shipping, handling and processing
    • Available in a wide variety of box sizes and configurations
    • Designed for manual applications in which devices are loaded by hand/tweezers/vacuum pen and unloaded by hand/tweezers.

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