Heidelberg Instruments, Inc.

2539 W 237th St Suite A
Torrance,  CA  90505

United States
  • Booth: 1661

Heidelberg Instruments - The power of direct writing

Heidelberg Instruments is a world leader in the development and production of high-precision photolithography systems, maskless aligners and nanofabrication tools. The systems range from small and easy to use tabletop systems to highly complex photomask production equipment with exposure areas of several square meters. Heidelberg Instruments systems are installed in academic and industrial sites in more than 50 countries and are used in research, development and production. With over 35 years of experience and more than 1,200 systems installed worldwide, we can provide lithography solutions specifically tailored to meet all our customers micro- and nanofabrication requirements for the production of 2D and complex 2.5 and 3D structures – no matter how challenging. Applications include MEMS, BioMEMS, nanotechnology, ASICS, TFT, micro-optics and others. 

 Press Releases

  • Heidelberg, Germany – Heidelberg Instruments has received a significant order from a leading semiconductor wafer-level packaging production company in Asia for its MLA 300 Maskless Aligner. With this order, Heidelberg Instruments has reached another important milestone towards the company’s goal of becoming a leading supplier of maskless lithography tools to the advanced wafer-level packaging industry.

    Optimized for industrial manufacturing, the MLA 300 Maskless Aligner features distinct benefits for the wafer-level technology: The flexibility of maskless lithography allows rapid design customizations, and even unique designs on each substrate. This is of particular use for chip packaging where mounted die shift and each panel is unique. Meeting these demands, the MLA 300 can be seamlessly integrated into wafer-level packaging production lines, fully automating wafer production with a resolution down to 2 µm lines and spaces. The MLA 300 reduces production costs and efforts by eliminating mask procurement, verification, and management requirements. Operating costs are reduced by utilizing a long-lifetime exposure laser and fewer consumables. Modularity enables fast maintenance, replacement, or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning.

    Since its market introduction at the end of 2019, the MLA 300 has received a terrific reception and has become a popular tool for the microfabrication industry. The MLA 300 comprises a customizable wafer handling system, customizable vacuum chucks, and a large autofocus compensation help account for challenges like warped substrates, and software designed for production environments.

    “This latest order, by a leading advanced wafer packaging production group, is a big step forward for us and maskless lithography. With the MLA 300, Heidelberg Instruments has introduced the most innovative maskless lithography system for mid-volume wafer production and high-volume prototyping. So far, several fabrication groups globally have purchased and installed the MLA 300 tool, replacing their traditional lithography production platforms, such as mask aligners and steppers,” says Alexander Forozan, Head of Global Sales and Business Development, Heidelberg Instruments group of companies. 

    MLA 300 is a versatile tool for application areas such as advanced semiconductor packaging, IR sensors, MEMS, electronic probes, and high precision electronic components.


    Veronika Loose

    Marketing and Communications  


    +49 931 90879288

    Further information:

    About Heidelberg Instruments Mikrotechnik GmbH:

    With over 35 years of experience and more than 1,200 installed systems, Heidelberg Instruments is one of the leading international players in developing and producing high-precision photolithography systems and nanofabrication tools. Heidelberg Instruments systems are installed in industrial and scientific facilities around the world. They are used for efficient direct writing and photomask fabrication for various industries, including semiconductors, quantum computing, photonics, 2D materials, IoT, and many related fields.


  • Maskless Aligner MLA300 for Volume Production
    Optimized for industrial manufacturing, with high throughput and seamless production line integration for the fabrication of sensors and sensor ICs, MEMS and microfluidic devices, analog and digital ICs, ASICs, advanced packaging, and other applications....

  • Product Highlights MLA300 Maskless Aligner

    Direct-write Lithography

    No mask-related costs, effort, or security risks.


    Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serialization.


    Shorter time from prototyping to production. Digital design management replaces conventional mask library.

    Exposure Quality

    Optical compensation of scaling, rotation; patented substrate tracking technology.

    Dynamic Autofocus

    Superior critical dimensions (CD) uniformity on warped or corrugated substrates.

    Exposure Speed

    300 x 300 mm in 19 minutes.

    Full Facility Integration

    Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES).

    Low Cost of Ownership

    Laser lifetime 10 years at 24/7 operation. Power consumption Eur 11,667 per year at 0.2 Eur/ kWh. Filters and replacement parts 5,400 Euro/year.

  • MLA150 for R&D, Rapid Prototyping & Small Volumes
    Maskless tool for R&D, rapid prototyping and small production volumes, designed for binary lithography. Application areas include nanofabrication of quantum devices (2D, semiconductor materials, nanowires) MEMS, micro-optics, sensors, MOEMS, and others....

  • Product Highlights MLA150

    Perfect for Multiuser Facilities

    Training <1 h to fully qualify as a user.

    Fast and Accurate Alignment

    250 nm front alignment, backside alignment, alignment error compensation.


    2 lasers can be installed simultaneously on the same system to expose the whole range of photoresists.

    Low Operation Costs and Easy Maintenance

    10-20 years of laser lifetime.

    Direct-write Lithography

    No mask-related costs, effort, or security risks.

    Grayscale Mode

    For simple 2.5D structures.

    Exposure Quality

    Edge roughness 60 nm; CD uniformity 100 nm; 40 nm address grid; autofocus compensation for warped/corrugated substrates.


    Specifically designed software and workflow make the tool operation fast and easy.

    Exposure Speed

    150 mm wafer in <16 min with 405 nm laser.

  • ULTRA – Fabrication of semiconductor components
    Designed to produce non-critical semiconductor photomasks and non-Manhattan designs, for the fabrication of semiconductor components for electronics and automotive industries, including microcontrollers, LED, IoT, MEMS, …...

  • Key Features ULTRA

    High Exposure Quality

    Line edge roughness 20 nm; CD uniformity 30 nm; positioning accuracy 40 nm; real-time optical autofocus; custom high numerical aperture (NA) write-lens optimized for laser exposure.

    High Precision

    XY stage fully designed and manufactured by Heidelberg Instruments; full air bearing stage; zero thermal expansion zerodur™ chuck; differential interferometer for position measurement.

    Precise Second Layer Alignment

    Sophisticated correction matrix based on a 2D measurement of the first layer. Compensation of arbitrary local position distortions; 100 nm accuracy.

    High Throughput

    High-speed SLM with high data rate for fast exposure. 6″ mask in < 45 minutes.

    Writing Stability

    Closed-loop environmental chamber complies with stringent requirements for semiconductor photomask production; integrated metrology system with flowbox and software corrections compensates for any variations in environmental parameters.

    Long life-time

    Economical high-power DPSS 355 nm laser; 20,000 hours of guaranteed lifetime.

    Overall Cost of Ownership

    Laser power consumption ca. 25.270 EUR/year at 0.2 EUR/kWh, 90% tool operation; other consumables 38.500 EUR/year.


    1.65 m x 2.54 m

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