Heraeus Electronics

24 Union Hill Road
Conshohocken,  PA  19428

United States
  • Booth: 1938

Heraeus Electronics, Innovative solutions provider

Heraeus Electronics is a leader in Advanced packaging and Semiconductor solutions for the electronics industry. For years Heraeus has supported the rapid growth in the semiconductor industry by using technical resources around the world to develop solutions for our customers while keeping price in mind. The ability to keep the pace with the industry has also given our customers the advantages they need to be succesful and profitable in this continuously changing enviroment. Please visit us during the show to see our latestest advancements in Solder paste, Wire, Ribbon, and Thick film solutions for semiconductor packaging. 


  • Welco AP5112
    Fine Pitch Solder Paste for SiP applications - available in Type 4 to 7 powders...

  • Welco® AP5112 is a water-soluble, halogen-free paste that has excellent printability due to its excellent inherent rheological properties, offering superior fine pitch printing performance. Stencil life for Welco® AP5112 is typically greater than 7 hours. The flux platform is compatible with multiple alloys (ultra low alpha (ULA) and super ultra low alpha (SULA) SAC305 alloys) and Welco® Powder for Type 6, 7 and beyond. Welco® AP5112 produces minimal, easily cleanable post-process residues, excellent wetting, and zero splatter.

    With Welco® AP5112 Type 7 solder paste all in one printing for flip chip and SMD pads is possible. This reduces processing steps, simplify SiP assembly processing steps and at the same time, eliminates incomplete soldering due to substrate warpage and/ or uneven placement of flip-chips.

  • Welco® LED100
    T7 SAC305 No-Clean Printing Paste...

  • Welco® LED100 series uses Heraeus proprietary Welco® Type 7 powders to achieve highly reliable solder joints- consistent solder volume without bridging or missing dots, best-in-class low void performance, and most importantly proven reliability (TCT, shear strength, etc.) performance for real miniLED applications.​
  • AgCoat® Prime
    Gold-Coated Silver Bonding Wire...

  • AgCoat® Prime Heraeus offers a real alternative to the gold wire for the packaging industry. AgCoat® Prime is a silver alloy bonding wire coated with a layer of gold. Because AgCoat® Prime's specifications are closely aligned to gold bonding wire, no inert gas is required, so no investment or changes to production equipment and facilities are necessary.

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