July 12-14, 2016
San Fransisco, CA
Based in Rhode Island Meister Abrasives USA is a highly innovative company with extensive experience in designing and manufacturing customized superabrasives fine grinding wheels.
Hybrid and ceramic bonded grinding tools represent a quantum leap in quality and reliability in semiconductor processing. Meister Abrasives' diamond grinding tools are used for the fine grinding of wafers and for wafer dicing. With best in class TTV values, surface qualities in the one digit Angstrom range are achieved.
The specially developed grinding tools from Meister Abrasives are used for processing materials such as Si, SiC, sapphire, GaN, InP, GaAS, LnNb, LnTa and extreme hard ceramics. Meister Abrasives' innovative Ultra-Fine 6 (UF6) grinding wheel technology can help prime wafer and device manufacturers shorten wafer preparation steps to the minimum. The ultra-smooth surface profile achieved with this method enable manufacturers to avoid diamond slurry costs, reduce CMP cost tremendously and drastically increase throughput.