July 12-14, 2016
San Fransisco, CA
Welcome to the Nordson Test and Inspection booth
Nordson DAGE, MATRIX, SONOSCAN and YESTECH offer an award-winning portfolio of Acoustic Micro Imaging, Automated Optical Inspection, Automated X-ray Inspection, Manual X-ray Inspection, Bond Testing, Micro Materials Testing and Wafer X-ray Metrology systems bringing powerful cost-effective solutions to the PCBA and Semiconductor industries.
Visit us to learn more about the XM8000 Wafer X-ray Metrology system for the analysis of Wafer bumps, TSV''s and FOWLP quality applications.
View the latest innovations in Test and Inspection including the new Gen7™ AMI system, the most advanced C-SAM, delivering a package of technology, ergonomics, advanced features and analysis, 4600 Automated Bondtester and M2 AOI which has been designed for automated inspection of advanced microelectronics and semiconductor packages. Also on display will be the Quadra™7 X-ray inspection system which represents the cutting edge of X-ray inspection performance, allowing features as small as 0.1µm to be resolved.