Osiris International GmbH

Josef-Schüttler-Str. 2
Singen,  78224

Germany
http://www.osiris-nano.com
  • Booth: 1445


We invite you to visit us on our booth!

Osiris International is a manufacturer of machines specializing in photolithographic process equipment used in semiconductor and microsystems (MEMS) technology.

The main application areas for surface treatment of wafers, substrates or masks are the following processing applications.

photoresist spin & spray coating, developing, baking,
wet cleaning, post CMP cleaning, etching, stripping & metal lift-off and
temporary bonding & de-bonding.

In addition to the production of our machines, which range from laboratory systems to semi-automatic and fully automatic systems, we also offer sub-systems such as PR Dispense Systems (Pumps, Syringe or CPD) and media supply cabinets with various canister designs.

We supply our technologies worldwide to major semiconductor manufacturers and internationally renowned research and development institutions.

In addition to our office in Germany, which covers all areas of administration, production and development, there is a foreign branch office Osiris International Inc. in Phoenix, Arizona especially for our US customers.


 Products

  • Resist spray coater - UNIXX SP 760
    The osiris spray coating system UNIXX SP760 is a innovative spray coating concept that combines two different spray methods. Spray coater for all topographies and shapes in one system....

  • UNIXX SP760 - Resist spray coating system

    FOR FLAT AND CONCAVE OR CONVEX SURFACES

    SEMI-AUTOMATIC SPRAY COATER

    The osiris spray coating system UNIXX SP760 is a innovative spray coating concept that combines two different spray methods into one system. With the newly developed method of 3D spray technology, for concave or convex (3D) surfaces, as well as the traditional in-line technology (2D) for substrates with topographic structure, we can now coat all topographies and shapes in one system.
    The device has an easy to operate user interface with all needed functions. All necessary media supplies such as CDA, N2 and Vacuum can be plugged in via plug-in connections and are controlled by software.

    BENEFITS

    •  For flat, concave or convex surfaces
    •  Designed for large scale optical devices and different flat substrates sizes
    •  6 axis robot system
    •  Up to two ultrasonic spray nozzles with automatic quick exchange function
    •  Integrated heating chuck
    •  User-friendly operator interface

    Spray coater for all topographies and shapes in one system.

    2D FOR ROUND WAFER SIZE
    from Ø200 mm up to Ø300 mm

    2D FOR SQUARE SUBSTRATE SIZE
    from 9” x 9” up to 21” x 21”

    3D for CONCAVE OR CONVEX SURFACES
    for large scale optical devices up to 300mm high

  • Automatic micro-electronics cluster - VARIXX 804
    The VARIXX 804 system platform offers the customer the possibility to configure the system so that it can be optimally equipped for the required process....

  • VARIXX 804

    AUTOMATIC MICRO-ELECTRONICS CLUSTER SYSTEM

    The OSIRIS system platform offers the customer the possibility to configure the system so that it can be optimally equipped for the required process.
    This VARIXX 804 automatic cluster system can be equipped with spin or spray coat and developer process modules, HMDS (vapor primer), hotplates and cool-plates for wafer sizes Ø2" /50mm up to Ø8" /200mm or square substrates up to 6” x 6” / 150 x 150 mm.
    One precise and fast running robotic are able to handle very thin fragile substrates very gently. With our system control unit via a 22" touchscreen display is used for optimum control and monitoring of the machine.

    BENEFITS

    • Substrate sizes up to 200mm (round) or 6"x 6" (square)
    • Flexible configuration of process modules
    • Dual arm robotic system for increasing throughput
    • On-the-fly product alignment
    • Full edge handling (backside protected) or standard vacuum gripping
    • Handling for thin, standard or bonded wafer (Si, glass & others)
    • SECS/GEM interface
    • Standard and customized chuck design

  • Photomasks etching & cleaning system - CHEMIXX E30
    Semi-automatic high performance etching & cleaning system for single substrate wet processing....

  • CHEMIXX E 30

    PHOTOMASKS OR WAFERS ETCHING & CLEANING SYSTEM

    PROCESSING OF PIRANHA (SPM) AND SC1.

    Semi-automatic high performance etching & cleaning system for single substrate wet processing.

    This CHEMIXX E 30 etching & cleaning system designed to provide users in industry with a productive and safe system. Also, the low life cycle cost (LCC) is a good reason why we recommend this equipment.
    The tool has an easy to operate user interface with all needed functions like, recipe programming, service, maintenance and user administration.
    In the design and construction of this system, great value was attached to safety and user friendliness.

    BENEFITS

    • Semi-automated system with manual loading and unloading
    • Masks size (square substrates) up to 230 x 230 mm / 9 x 9 inch
    • Wafer size up to 300 mm (Ø12 inch)
    • Up to two electric media arms
    • Media arm for 6 media lines
    • Wide range of nozzles available
    • Low contact or customized chucks
    • Heated media lines: 20 - 80°C
    • Chamber rinse nozzle system
    • Manual DI-water gun
    • Integrated media cabinet for max. 3 canisters (each 10ltr.)
    • OPTIONAL: External media cabinet for different chemicals e.g.(H2SO4, H2O2, NH4OH, HF, BOE)

    TYPES OF NOZZLES

    Aqueous based chemicals;
    Equipped for chemical processing via:

    1. Puddle or spray nozzle
    2. 5-hole puddle nozzle
    3. Atomizer nozzle
    4. BSR (Back side rinse) nozzle

    Equipped for mechanical processing via:
    1. Brush system
    2. High pressure
    3. Megasonic nozzle


Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".


For Technical Support with this webpage, please contact support.