Meister Abrasives USA, Inc.

201 Circuit Rd
North Kingstown,  RI  02852-7440

United States
http://www.meister-abrasives-usa.com
  • Booth: 1542

Based in Rhode Island Meister Abrasives USA is a highly innovative company with extensive experience in designing and manufacturing customized superabrasives fine grinding wheels.

Hybrid and ceramic bonded grinding tools represent a quantum leap in quality and reliability in semiconductor processing. Meister Abrasives' diamond grinding tools are used for the fine grinding of wafers and for wafer dicing. With best in class TTV values, surface qualities in the one digit Angstrom range are achieved.

The specially developed grinding tools from Meister Abrasives are used for processing materials such as Si, SiC, sapphire, GaN, InP, GaAS, LnNb, LnTa and extreme hard ceramics. Meister Abrasives' innovative Ultra-Fine 6 (UF6) grinding wheel technology can help prime wafer and device manufacturers shorten wafer preparation steps to the minimum. The ultra-smooth surface profile achieved with this method enable manufacturers to avoid diamond slurry costs, reduce CMP cost tremendously and drastically increase throughput.


 Press Releases

  • Zürich, Switzerland, September 12, 2021 – Superabrasives leader Meister Abrasives celebrates its 70- years anniversary since it was first founded on September 12, 1951.

    Heritage – a powerful notion that embodies all the values, traditions, and behaviors that one carries within; an inseparable part of one’s identity. Meister Abrasives takes pride in its rich heritage and celebrates its 70th birthday with a deep gratitude because it is only by knowing and honoring its past that one can build a strong future.

    Meister Abrasives’ story starts 70 years ago on September 12, 1951 in Andelfingen, Switzerland with an exceptional visionary – Konrad Meister. Ahead of his time, the founder of Meister Abrasives approached his business with a futuristic mindset and true authenticity. His focus to design and produce products of the highest Swiss quality for worldwide distribution has been carried over the years onto today’s endeavors of Meister Abrasives to deliver solutions that embody the true meaning of Swissness: exceptional quality, precision and unparalleled performance.

    Meister Abrasives has been the epitome of cutting-edge technological innovation since its inception: from the introduction of its proprietary vitrified superabrasive wheels revolutionary for the industry, through the highly specialized CERALOX products and the Vitrified-Micron (VM) technology for inner diameter (ID) grinding, to the industry-wide standard cubic boron nitride (CBN) and diamond tools in vitrified bonding – Meister Abrasives is constantly pushing the boundaries of the possible. “Innovation to us isn’t just a goal that is once achieved but rather a constant process and an attitude: boldness to go beyond what is already established, to step into the unknown; a constant stream of creation and transformation.” – comments CEO Frederik Dresen. That spirit of innovation, of disrupting established models in the industry is still what drives Meister Abrasives and makes it a global leader.

    Produced in the brand’s proprietary research and production center in Switzerland, all Meister Abrasives’ solutions are of the highest quality. The in-house test center provides the greatest possible flexibility, fast reaction times and service quality allowing the brand to meet the ever-expanding customer requirements. As an agile international company, Meister Abrasives remains focused on working hand-in-hand with its customers to optimize their processes by understanding the challenges they face and offering highly customized solutions.

    Meister Abrasives began with an entrepreneur’s vision and gradually transformed into an internationally operating company. It is only natural that family values are imprinted on the identity of the brand: from the way it treasures each employee to the way it interacts with its customers. Mr. Frederik Dresen: “To this day, the very same bicycle that our founder used to visit customers, is exhibited in our offices to remind us of the passion, dedication and boldness of Mr. Meister.” While Meister Abrasives is rapidly growing, its strong bond to the family values becomes even more evident.

    Today, Meister Abrasives is more than ever committed to its quest of reshaping the future on a global scale while staying true to its values of uncompromising quality, cutting-edge innovation, precision and tailored customer solutions. CEO Mr. Dresen and his team continue to write Meister Abrasives’ legacy to the world of superabrasives, establishing the company as an undisputable innovator in the automotive and e-mobility industries. Immerse into Meister Abrasives’ world and learn more about the brand’s cutting-edge technological solutions that empower people in their everyday life. With its hunger for revolutionizing innovations and turning the impossible into possible, there is no doubt that Meister Abrasives’ story is far from being complete…it has just begun.

    ABOUT MEISTER ABRASIVES Meister Abrasives is a leading and highly innovative company with extensive experience in designing and manufacturing customized cutting-edge industrial superabrasive tools for high-precision grinding applications. Founded in 1951, Meister Abrasives is synonymous to exceptional quality, precision, and individualized customer solutions – values inherent not only to the brand but also to the land in which it originated – Switzerland. Being at the forefront of technological innovation, Meister Abrasives is dedicated to its quest of creating innovation with a higher meaning through sustainable use of resources, control of own manufacturing processes, and uncompromising attitude to quality in customer care, facilitated by the brand’s international structure with family values.

  • Zürich, Switzerland, October 1, 2021 – Superabrasives leader Meister Abrasives announces its participation in the 51st edition of the premier event SEMICON West in December 2021.

    Swiss company Meister Abrasives will take part in the flagship microelectronics annual conference in North America – SEMICON West. The 51st edition of the conference will take place in December 7-9, 2021 in San Francisco, California, USA – the city of innovation. Held in a hybrid format for the first time ever, the conference connects the entire extended electronics supply chain – in one place, at one time. Combining a live conference with a virtual platform, the 51st SEMICON West gathers global thought leaders and visionaries to highlight the latest electronics trends, innovations, and developments in keynotes, TechTALKS and Meet the Experts sessions. Moscone Center (George R. Moscone Convention Center) – the largest convention and exhibition complex in San Francisco – will host this year’s premier event and offer notable speakers a platform to express their ideas in further developing the market of semiconductor appliances for professional, as well as for daily use.

    As an official exhibitor, Meister Abrasives of Switzerland will present to the public some of its groundbreaking semiconductor solutions and reveal its latest technological innovation in the area of silicon carbide (SiC) – the Ultra-Fine 6 (UF6) grinding wheel. Hybrid and ceramic bond diamond grinding tools represent a quantum leap in quality and reliability in semiconductor processing. Meister Abrasives’ diamond grinding tools target fine grinding of wafers and wafer dicing. With best-in-class total thickness variation (TTV) values, surface qualities in the one-digit Angstrom range are achieved. The specially developed grinding tools of Meister Abrasives are used for processing materials such as Si, SiC, sapphire, GaN, InP, GaAS, LnNb, LnTa and extreme hard ceramics. Meister Abrasives’ innovative UF6 grinding wheel technology allows prime wafer and device manufacturers to shorten wafer preparation steps to the minimum. The ultra-smooth surface profile achieved with this method enables manufacturers to avoid diamond slurry costs, reduce chemical mechanical polishing (CMP) cost tremendously and drastically increase throughput.

    Visit Meister Abrasives’ stand – booth 1542 – to discover the brand’s latest innovation and personally meet the brand’s experts on semiconductors. Immerse into Meister Abrasives’ world and learn more about the brand’s cutting-edge technological solutions that empower people in their everyday life.

    ABOUT MEISTER ABRASIVES

    Meister Abrasives is a leading and highly innovative company with extensive experience in designing and manufacturing customized cutting-edge industrial superabrasive tools for high-precision grinding applications. Founded in 1951, Meister Abrasives is synonymous to exceptional quality, precision, and individualized customer solutions – values inherent not only to the brand but also to the land in which it originated – Switzerland. Being at the forefront of technological innovation, Meister Abrasives is dedicated to its quest of creating innovation with a higher meaning through sustainable use of resources, control of own manufacturing processes, and uncompromising attitude to quality in customer care, facilitated by the brand’s international structure with family values.

  • Zürich, Switzerland, October 1, 2021 – Superabrasives leader Meister Abrasives revolutionizes wafer processing with its latest technological innovation – Ultra-Fine 6.

    Leader in high-precision grinding solutions, Meister Abrasives introduces its latest break-through technology in the area of silicon carbide (SiC) and other semiconductor processing solutions – the Ultra-Fine 6 grinding wheel. Having recognized the increasing need for grinding and polishing hard materials to perfection, Meister Abrasives developed the Ultra-Fine 6 (UF6) – a cutting-edge innovative solution born in the brand’s own laboratory and perfected in its state-of-the-art test-center in Switzerland. This new vitrified-bond ultra-fine grinding technology combines unparalleled quality and exceptional performance to achieve unseen until now results. SiC wafers ground with Meister Abrasives’ Ultra-Fine 6 wheels exhibit reduced crystal damage, mirror-like surface and improved wafer geometry even on hard-to-cut materials, such as SiC, GaN, Saphir, LT/LN and hard ceramics.

    Meister Abrasives’ Ultra-Fine 6 wheel achieves an atomic level step-terrace finishing: the values obtained – Ra = 0.5 nm & TTV < 1 µm speak for a sub-nanometer average surface roughness and an incredibly low total thickness variation. Surface qualities in the one-digit Angstrom range are achieved. The highly porous open structure of the wheel allows for an extremely low grinding force causing the smallest sub-surface damage and thus, achieving ultra-smooth SiC surfaces and improved wafer geometry. Not only do the Ultra-Fine 6 grinding wheels achieve atomic level step-terrace finishing but due to their excellent self-dressing behavior combined with optimized grinding processing parameters, they also increase wafer throughput on any tool platform.

    At the heart of that novel grinding technology is Meister Abrasives’ proprietary bond-grit formulation developed back in the 80s. The unique bond-grit recipe allows for modifications not only of the grit but of the whole formula. Customizing the nanostructure allows Meister Abrasives to adapt to each surface condition: whether the start surface is saw, lasered, lapped or polished, Meister Abrasives has the right tools. The brand’s expertise in varying the properties of the abrasive, the type of the bond and the engineering of the wheels, allows it to make grinding wheels that suit any individual use.

    By employing Meister Abrasives’ Ultra-Fine 6 technology, manufacturers of prime wafers and devices can minimize wafer processing steps and save a significant amount of processing time. The achieved surface is so perfect that there is no need for diamond polishing, which is a slow and very costly process. The technical impact of those novel wheels is a real breakthrough: rather than having lengthy processing times as with lapping and diamond polishing, SiC wafers can be ground in less than ten minutes with fewer fabrication steps, completing the process in a minimum fraction of time. The ultra-smooth surface profile allows manufacturers to fully cut diamond slurry costs, slash the cost of chemical mechanical polishing (CMP) and drastically increase throughput.

    The long life and stable grinding current of Meister Abrasives’ innovative grinding wheels combined with the achievable ultra-fine surface roughness is a powerful fusion that is unique to the market. Immerse into Meister Abrasives’ world and learn more about the brand’s cutting-edge technological solutions at meister-abrasives.com.

    ABOUT MEISTER ABRASIVES

    Meister Abrasives is a leading and highly innovative company with extensive experience in designing and manufacturing customized cutting-edge industrial superabrasive tools for high-precision grinding applications. Founded in 1951 in Switzerland, Meister Abrasives is synonymous to exceptional quality, precision, and individualized customer solutions – values inherent not only to the brand but also to the land in which it originated – Switzerland. Being at the forefront of technological innovation, Meister Abrasives is dedicated to its quest of creating innovation with a higher meaning through sustainable use of resources, control of own manufacturing processes, and uncompromising attitude to quality in customer care, facilitated by the brand’s international structure with family values.


 Products

  • Coarse Grinding Wheels
    Meister Abrasives’ Coarse Grinding Wheels are the perfect solution for back grinding and prime wafer grinding – processes where the quality of the grinding wheel is of the utmost importance....

  • Each of the three technologies available for the Coarse Grinding Wheels exhibits particular characteristics. The extremely high pore volume of the 3D Diamond structure assures lowest grinding forces with lowest chipping and best surface quality while also achieving maximum service life of the wheel. Exceptionally cutting of extremely hard materials and having high wear resistance is what makes the Ceramet Diamond Hybrid Bond unique. The Vitrified Diamond (Vit-DIA) technology allows high cutting volumes and high wear resistance.
  • Ultra-Fine Grinding Wheels
    Polishing and/or chemical mechanical polishing (CMP) is usually a lengthy and costly process that should preferably be avoided or reduced to the minimum, if possible. Meister Abrasives’ Ultra-Fine Grinding Wheels eliminate polishing and reduce CMP....

  • Whether a Vit-DIA, a Vitrified Micron VM-Diamond or a 3D-DIA formulation, these technologies allow the wheels to grind with minimum force, applying less stress on the wafer and thus, to achieve smoothest surfaces and minimized subs surface damages in the low nanometer range. Combined with optimal processing parameters, an extremely flat wafer with best geometry for total thickness variation (TTV), bow and warp can be achieved. A unique feature of Meister Abrasives’ wheels is that it helps to skip diamond polishing and minimize the CMP processing time. By employing Meister Abrasives’ newest Ultra-Fine grinding wheels, productivity is increased and throughput is boosted.

    Vitrified Diamond (Vit-DIA) technology allows for high cutting volumes and high wear resistance also on fine and precise surfaces. The extremely high pore volume of the 3D Diamond structure assures lowest grinding forces with best surface quality while also achieving maximum service life of the wheel. Precise geometries and best surface qualities are achievable thanks to the Vitrified Micron Diamond (VM-DIA) technology.

  • Boule / Ingot Grinding Wheels
    Meister Abrasives offers high quality wheels for boule/Ingot grinding that avoid cracking and improve grinding consistency. Due to the porosity of the wheels, they grind with less force and cause minimal boule stress during the grinding process....

  • Vitrified Diamond (Vit-DIA) and Hybrid Bond Diamond (Ceramet-DIA) technology allow high cutting volumes and high wear resistance. Exceptionally cutting extremely hard materials, such as SiC or Sapphire, and showing highest removal performance with best profile stability is what makes the Ceramet Diamond Hybrid Bond unique. Further advantages of Meister Abrasives’ wheels include their dressability and their suitability to be used in automated processes. 

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