July 12-14, 2016
San Fransisco, CA
Mi Equipment welcomes all to experience our latest product.
Mi Equipment is a leading technology player in the semiconductor industry since 2007 and is part of Mi-Technovation Group. We have strong global presence with World Class R&D and Manufacturing Facilities in Malaysia, China, Taiwan, Korea and USA. With our highly passionate engineering, sales and technical teams, we provide leading edge technologies covering from Wafer Fab Backend, Assembly, Final testing and inspection.
We offer advanced WLCSP Die Sorter with fully integrated inspection/ test & marking capabilities, Wafer Reconstruction solution (FOWLP), Final Test Handlers, IR vision Inspection, Laser-assisted Bonding and Smart Factory Automation Innovations.
Mi Equipment has been a key partner to the world’s major semiconductor IDMs and OSATs with close to 1000 machines installed worldwide.
Vision inspection machine for wafer and package inspection with IR capabilities
Final test handler for Wafer Level, Package Level and Wafer Known-Good-Die Testing (KGD)
Die sorting and wafer reconstruction machines for advanced wafer level packaging, such as WLCSP, FOWLP and CSPs
Precision bonding machine (LAB/LCB) for extra fine pitch with thin die and substrate for large die & 2.5D packaging