Plot 18 & 19, Technoplex, Medan Bayan Lepas,
Taman Perindustrian Bayan Lepas,
Georgetown,  Penang  11900

  • Booth: 1754

Pentamaster provides automation technology and solutions to multinational manufacturers in the semiconductor, electro-optical, consumer electronics, automotive and medical sector, spanning across APAC, North America and Europe. Besides the production plant in Penang HQ and Batu Kawan, the Group has strategic presence globally with offices located in the USA, Japan, Singapore and production facilities in China. Thus, we are able to serve customers from around the world in various industries.

The group has currently diversified into 4 business solutions: Automated Test Equipment, Factory Automation Solutions, Warehouse Automation Solutions and Medical Automation Solutions.

With more than 25 years of experience in dealing with high-end technologies companies across worldwide market, we are confident to compete in terms of manufacturing flexibility, quality services, cost effective solutions, timely delivery and are positioned to greater growth.


  • Full Range Assembly and Test Technologies for IGBT
    At Pentamaster, our end-to-end solutions for IGBT are highly customizable and configurable to suite your needs & requirements....

  • With the rise of EV (Electrical Vehicles), it demands for high-end test technologies and precision assembly solutions for IGBT, SiC and GaN-based power devices.

    At Pentamaster, we offer end-to-end solutions for IGBT which are highly customizable and configurable to suite your needs & requirements.

    Our solutions cover nearly every aspect of the manufacturing process for these power devices ranging from component assembly to final inspection and test.

    •High Temp/Voltage Burn-in Test for Wafer/Module-Level Packages
    •Advanced AOI System for Wafer-Level SiC
    •DBC Substrate Segregation
    •High Precision Laser Marking for DBC Substrate and Plastic Housing
    •Ambient/Hot DBC Substrate Test
    •DBC Substrate Placement
    •Heatsink Placement
    •High Speed Epoxy Dispensing/Screwing Process
    •Pin Insertion (Reeled Thru-Hole/Press-Fit into Housing)
    •Final Test (Isolation, AC/DC Test under Tri-Temperature)
    •Final AOI (2D/3D Vision Inspection)
    •Premium Quality Packaging (Label Application, 2DBC Scanning)

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