PENTAMASTER

With the rise of EV (Electrical Vehicles), it demands for high-end test technologies and precision assembly solutions for IGBT, SiC and GaN-based power devices.

At Pentamaster, we offer end-to-end solutions for IGBT which are highly customizable and configurable to suite your needs & requirements.

Our solutions cover nearly every aspect of the manufacturing process for these power devices ranging from component assembly to final inspection and test.

•High Temp/Voltage Burn-in Test for Wafer/Module-Level Packages
•Advanced AOI System for Wafer-Level SiC
•DBC Substrate Segregation
•High Precision Laser Marking for DBC Substrate and Plastic Housing
•Ambient/Hot DBC Substrate Test
•DBC Substrate Placement
•Heatsink Placement
•High Speed Epoxy Dispensing/Screwing Process
•Pin Insertion (Reeled Thru-Hole/Press-Fit into Housing)
•Final Test (Isolation, AC/DC Test under Tri-Temperature)
•Final AOI (2D/3D Vision Inspection)
•Premium Quality Packaging (Label Application, 2DBC Scanning)

Pentamaster is one of the pioneer burn-in test solutions providers for wafer-level packages such as VCSELs, Silicon Carbides (SiC), Micro LEDs and LEDs. Our Burn-in Test Solutions help to deliver fully tested and highly reliable dies before module assembly to help manufacturers save cost while gaining higher ROI.

The global market’s demand for VCSELs, Silicon Carbide (SiC), Micro LEDs and LEDs are expanding a lot quicker than ever before as technology is also constantly rapidly evolving. For instance, VCSELs are rapidly adopted in the 3D sensor segments for applications such as facial recognitions and LiDAR. Silicon Carbide on the other hand plays a huge role in the development of electrical vehicles (EV) while Micro LEDs is an emerging flat-panel display for smart devices offering brighter, slimmer design and is less prone to burn-in defects.

This places a huge challenge onto manufacturers in ensuring that their products had been stringently tested for their performance and reliabilities through burn-in tests at wafer-level to phase out early life failures and defects. One of the key benefits to performing burn-in test onto packages at wafer-level is because it helps to save cost by reducing unnecessary wastages down the line as well as shorter cycle times before the wafer is packaged.

At Pentamaster, riding on the prevalence of Industry 4.0, we have devoted ourselves to the factory automation sector for many years by automating the manufacturing processes and production line of various industries across various part of the world through i-ARMS. Hence, we possess the skills and know-hows as well as years of experience to help various industries meet the increasing production demands of today’s competitive market.

i-ARMS is a one-stop factory automation solution designed to optimize the performance of production for manufacturing industries by eliminating the reliance on  labors while providing real-time production monitoring system which will result in higher productivity and enhanced product’s quality consistency.

The system consists of many technologies which are combined into one automation solution. Technological innovations incorporated into i-ARMS include Material Handling Conveyor System, RFID, MES, Robotic System Services and Vision Inspection and Guidance system.