MRSI Systems

554 Clark Road
Tewksbury,  MA  01876

United States
https://mrsisystems.com
  • Booth: 1556


MRSI Systems Die Bonding and Epoxy Dispensing Systems

MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com 


 Press Releases

  • Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135) on July 30th, 2021 by the China National Intellectual Property Administration (CNIPA). This patent covers an innovative design that utilizes a precision horizontal tool holding turret for rapid and in-process calibration-free tool changing. This design significantly improves throughput when multiple tools are needed in fabricating complex multi-die devices by practically eliminating time consuming tool changeovers.

    This patent is among the first of many patents being applied for in China and around the globe. We expect more patents to be granted following this success. Our effort in rigorously seeking patent protection in China reflects our confidence in the Chinese market potential for our die bonder systems, as well as in the increasing effectiveness of intellectual property protection in China. Innovation is key to our ability to support our customers. Mycronic is committed to technological innovations and is determined to enforce protection of our intellectual property worldwide.

  • MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2021 Silver Honoree for the Laser Focus World Innovators Award in the Manufacturing Equipment for Photonic Components category.

    The MRSI-H-TO was recognized for an innovative design that resulted in marked improvement over previous methods employed, approaches taken, or products/systems used. The MRSI-H-TO is the industry’s first 1.5 micron ultra-flexible, high-speed die bonder platform for multi-dies, and multiple-processes, targeting the new complex TO-based photonic device volume manufacturing for the high-speed DCI, and 5G wireless network rollout.

    The MRSI-H family of 1.5 micron ultra-flexible, high-speed machines is widely used by the optoelectronics industry. The MRSI-H-TO variant provides a highly demanded high-volume manufacturing solution for new complex TO-based photonic device. This machine can handle multiple sizes of TO cans, such as TO38/46/56/65/72, and both eutectic and epoxy processes can be completed in one machine. The platform is equipped with the MRSI patented fast tool changer, dual fast heating and cooling eutectic stages and multi-process parallel processing capability to maximize productivity, while maintaining maximum flexibility.

    A customer who has been operating the MRSI-H-TO machine over the last two years said, “The machine provides high productivity and high stability, which proves that it is the best solution for multi-chip and multi-process complex TO packaging. The machine also supports CoC and gold box packaging. It is a very flexible machine that makes our production line highly agile, which our customers appreciate. MRSI also has a very professional and highly dedicated local service team that provides support around the clock.”

    Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI, said, “We are honored to receive the Laser Focus World’s Annual Innovators Award again, which signifies that MRSI’s innovation capabilities continue to be recognized and valued by industry experts. The trust placed upon us by customers and industry experts continues to inspire us to deliver cutting edge innovations for the optoelectronics industry.”

    For additional information, please contact:
    Jennifer Russo
    Marketing Manager, MRSI Systems (Mycronic Group)
    Tel: +1 (978) 495-9731, e-mail:  [email protected]
    Time Zone: ET – Eastern Time

    About Laser Focus World

    Published since 1965, Laser Focus World has become the most trusted global resource for engineers, researchers, scientists, and technical professionals by providing comprehensive coverage of photonics technologies, applications, and markets. Laser Focus World reports on and analyzes the latest developments and significant trends in both the technology and business of photonics worldwide — and offers greater technical depth than any other publication in the field.

    About MRSI Systems

    MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

    About Mycronic 

    Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom and the United States. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com

  • MRSI Systems won the China Optoelectronics Expo Award (CIOE Award) for the latest MRSI-HVM 1.5 micron series of products. The MRSI-HVM with conveyor is an outstanding innovation, widely used in optoelectronic production, specifically the production of high-density and high-speed data center optical interconnection and backbone network transmission using 400G+ photoelectric devices, as well as 5G wireless applications using complex TO-based TOSA/ROSA devices containing DFB/WDM/EMLs. The new and innovative MRSI-HVM 1.5 micron series provides the best automated manufacturing solution for high-mix and high-volume optoelectronic production, in the era of data center / 5G, and brings the best return on investment for optoelectronic and high-power laser device manufacturing customers.

    “China Optoelectronic Expo Award” is proposed by the organizing committee of China International Optoelectronic Expo (CIOE), approved by the presidium of CIOE, and chosen at the special meeting of the Evaluation Expert Committee, with new optoelectronic products and new technologies as the theme of product technology achievement award. After three rounds of expert panel reviews and another round of review by the presidium, 37 of the 97 candidate projects were selected. Finally, 34 projects participated in the on-site review of “China Optoelectronic Expo Award” held in Bao’An New Exhibition Hall on 15th September 2021.

    After this extensive evaluation by the committee, MRSI was awarded the prestigious silver medal and certificate.


    On- site judging

    On-site awards


 Products

  • MRSI-HVM Family 1.5-Micron Die Bonders
    High speed, flexible, 1.5-micron die bonders for high volume manufacturing...

  • The MRSI-HVM product family is the best-in-class die bonder based on comprehensive field testing, with leading speed, zero-time tool change, and <1.5 micron accuracy. The superior performance is enabled by dual-head, dual-stage design with integrated “on-the-fly” tool changer, ultrafast eutectic stage, and multi-level parallel processing optimizations. Applications include: Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB).  

    A sister family of the MRSI-HVM is the MRSI-H family, which features machines that has a smaller footprint and lower cost. Each MRSI-H variant is tailored for a different application segment, while focusing on flexibility in handling different dies and processes.  

  • MRSI-705 5-Micron Die Bonder
    The MRSI-705 5-micron die bonder sets the mark for high-precision, high-speed component assembly. ...

  • The MRSI-705 5-micron die donder is the industry standard for high-precision component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform, with the largest installed base for advanced packaging in the industry. Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more.

    The MRSl-705 offers an optional Turret configuration to significantly increase the speed and potential volume from our machine without sacrificing flexibility. This feature delivers an “on-the-fly" tool changer holding up to 12 tools with zero tool changeover downtime This leads to increased machine efficiency, higher output and lower manufacturing costs. Applications include processes requiring a large number of parts-specific tools, using eutectic bonding, and the need to assemble complex products with a multitude of component types.

  • MRSI-M3 3-Micron Die Bonder
    The highly configurable MRSI-M3 platform delivers a mid-range of solutions to maximize your investment return....

  • The system delivers an unmatched combination of 3-micron accuracy, automation, speed and reliability, allowing assembly processes such as eutectic die bonding, UV epoxy die attach and flip-chip assembly. The system is ideally suited for manufacturers of microwave modules, IR sensors, MEMS, multi-chip modules, stacked assemblies, hybrid devices and photonic packages.

    The MRSI-M3 3-micron die bonder sets the industry standard for ultra-precision, high-complexity die attach in high volume production environments. With features such as force control, ultra-precise placements, and 360° die orientation, the MRSI-M3 die bonder ensures high yields, high quality and high reliability in advanced packaging.


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