Epoxy molding compounds for encapsulation of semiconductor device, which protect delicate semiconductors from moisture and shock, are one of our leading products. We realize smooth supply worldwide thorough our four-country, four factory production system (Japan [Kyushu], Singapore, China, and Taiwan). We have released the EME-G series and E series materials, which do not contain brominated flame retardants, and are otherwise working to reduce the environmental load.
Based on our technology that accumulated in epoxy molding compound for encapsulation of semiconductor devices, we developed the electronic control unit (ECU) direct molding material for automobile which is required the resistance to high temperature and severe environment and high reliability. In applying to ECUs such as fuel injection electronic control, our material contributes to large downsizing, light weighting and price reduction compared to the conventional resin case type ECU.