Nikon continues to expand the MEMS Stepper product line to satisfy the unique photolithography requirements of Air Bearing Surface (ABS) fabrication for magnetic heads, Micro Electro Mechanical Systems (MEMS) and Light Emitting Diodes (LED). These steppers are also used in back-end processing, as well as optoelectronics, discrete semiconductors and crystal oscillator manufacturing. These specialized Nikon lithography solutions deliver maximum stepper yield at the lowest possible cost.
Although MEMS do not have the same aggressive requirements for imaging or overlay capabilities that are demanded by semiconductors, they necessitate that the lithography systems are able to handle extremely warped wafers and very thick films, and accommodate significant step heights with reasonable overlay accuracy. In addition, bulk MEMS applications, Taiko-processed or bonded thin wafers often need precise alignment to marks located on the backside of the wafer surface. Nikon MEMS Steppers fully satisfy the critical requirements of these dynamic markets, and well over 160 systems are in use by customers around the world today.