July 12-14, 2016
San Fransisco, CA
Please join us in booth 1957 to see a live demonstration of Royce''s latest automatic die sorter, the AP+, configured with automatic top and edge inspection. Specializing in low to medium volume applications requiring frequent process changeover, the AP+ has options available for no surface contact pick-up, bumped die, MEMS devices, thin/fragile die handling, etc. Royce engineers are glad to discuss with you the latest bond test and die sorting challenges and solutions.